SemiLEDs introduces new Chip Scale LED Series
Combines flip chip and ReadyWhite technologies for white-chip solution
SemiLEDs Corporation has announced sampling and mass production of its newest line of white chip scale packages, the ReadyMount Enhanced CSP, or EC series.
Combining SemiLEDs' Enhanced Flip chip (EF) approach with the company's ReadyWhite phosphor technology, the EC is said to offer flexibility, reliability and manufacturability in a single 1.4 x 1.4mm with a low profile device of 0.4mm.
In addition to the manufacturing benefits of the chip scale package, the elimination of the wire bonds is claimed to improve the optical integration characteristics by taking advantage of the unobstructed and nearly edge-to-edge emitting chip surface which enables the die to be mounted very close together.
This simplifies the optics by eliminating the need for complex mixing lenses which are used to control ghosting and shadows in narrow beam applications. The glass top surface is also mechanically robust, and is not prone to the handling damage or stresses faced by wire-bond or flip chips with a silicone covering. The typical 145 degree field of view also demonstrates good colour-over-angle characteristics as a result of the ReadyWhite technology.
Mark Tuttle, general manager for SemiLEDs Optoelectronics, said: "Our unique Chip Scale Package brings all the benefits of SemiLEDs' rugged EF Series FlipChip architecture to an extremely compact emitter, which is simple to integrate using standard tape and reel surface mount manufacturing. This innovation reduces final component cost up to 50 percent, with a packaging cost reduction of up to 80 percent over conventional packaging. EC Series products, such as the EC-W1414, enable system-integrators and luminaire manufacturers a direct path to a highly cost effective solution on a per-lumen basis now, with additional viewing angles and die sizes under development."
The EC is rated for input power of up to 3W and is a fully packaged white emitter SMD component, ready for surface mounting on any board level module or COB application. The compact chip scale package can produce outputs of up to 300 lumens at 1A. The SemiLEDs EC series is available in standard ReadyWhite correlated colour temperatures ranging from 2700K to 10,000K with colour rendering indices up to 90 minimum.
While useful for creating compact multi-die white packaged LEDs, the ReadyMount products will provide particular benefit to light-engine and luminaire manufacturers who have previously had to rely exclusively upon packaged die solutions, says the company.