MACOM To Show Optical Portfolio In China
Devices for PON, 10G, 100G applications and beyond
MACOM, the supplier of high performance RF, microwave, and millimeter wave products, will showcase its portfolio of CDRs, TIAs and laser drivers for 10G to 100G applications and beyond at the China International Optoelectronic Exposition (CIOE) this week.
CIOE will be held at the Shenzhen Convention & Exhibition Centre from September 2nd to 5th, 2014 in Shenzhen, China.
Devices on show include 100G chipsets for CFP2/4 and QSFP28 form factors; modulator drivers for coherent applications at 100G and beyond; 10G complete chipset for SFP+/XFP MSA modules; GPON ONU/OLT complete chipset solutions; and the next generation of 10GEPON and XGPON1 ONU/OLT chipsets.
AngelTech Live III: Join us on 12 April 2021!
AngelTech Live III will be broadcast on 12 April 2021, 10am BST, rebroadcast on 14 April (10am CTT) and 16 April (10am PST)
and will feature online
versions of the market-leading physical events: CS International
and PIC International
PLUS a brand new Silicon Semiconductor International
Thanks to the great diversity of the semiconductor industry, we are always chasing new markets and developing a range of exciting technologies.
2021 is no different. Over the last few months interest in deep-UV LEDs has rocketed, due to its capability to disinfect and sanitise areas and combat Covid-19. We shall consider a roadmap for this device, along with technologies for boosting its output.
We shall also look at microLEDs, a display with many wonderful attributes, identifying processes for handling the mass transfer of tiny emitters that hold the key to commercialisation of this technology.
We shall also discuss electrification of transportation, underpinned by wide bandgap power electronics and supported by blue lasers that are ideal for processing copper.
Additional areas we will cover include the development of GaN ICs, to improve the reach of power electronics; the great strides that have been made with gallium oxide; and a look at new materials, such as cubic GaN and AlScN.
Having attracted 1500 delegates over the last 2 online summits, the 3rd event promises to be even bigger and better – with 3 interactive sessions over 1 day and will once again prove to be a key event across the semiconductor and photonic integrated circuits calendar.
So make sure you sign up today and discover the latest cutting edge developments across the compound semiconductor and integrated photonics value chain.
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