News Article

Ruckus Wireless Chooses TriQuint WiFI Power Amps

New PAs support latest 802.11ac standard and Power Over Ethernet

TriQuint Semiconductor has announced that Ruckus Wireless, a global supplier of wireless systems, has selected TriQuint's two new 5GHz WLAN power amplifiers (PAs) for its fifth-generation 802.11ac Wi-Fi platforms.

Several other WiFi infrastructure OEMs are evaluating TriQuint's new PAs. The TQP5525 and the TQP5523 support the technically challenging features of the new 802.11ac WiFi standard, such as multiple-use MIMO with minimal co-channel interference. 

The PAs are also designed to support the power and voltage requirements of Power over Ethernet (PoE) applications. The TQP5525 provides 0.5W output power, while the TQP5523 supports 0.25W to achieve lower power consumption at a lower cost. Both PAs operate over  4.9 to 5.925GHz.

"TriQuint continues to deliver advanced 802.11ac Wi-Fi products that enable OEMs to support the users' increasing demand for faster data throughput," said James Klein, TriQuint's VP of infrastructure and defence products. "Our new WLAN power amplifiers are optimised for high data rates and range, which creates a unique user experience in the rapidly expanding Internet infrastructure market. According to customer feedback, our TQP5525 delivers up to 3dB higher power output over our closest competition, which would double the operating range of access points delivering 802.11ac throughput."

As consumers and businesses increasingly turn to Wi-Fi networks for data and multimedia connectivity, adoption of the 802.11ac standard continues to accelerate. Wi-Fi devices with the new standard are expected to represent 45 percent of consumer Wi-Fi equipment shipments by year-end, according to ABI Research. 3 Significant growth in Wi-Fi network deployments also is being fueled by service providers' plans to off-load and compliment data traffic from strained LTE networks, especially in congested urban areas.

The broadband performance of the TriQuint PAs supports the global expansion of available Wi-Fi spectrum as well as the emerging intelligent transportation systems planned in the dedicated short-range communications4 (DSRC) bands, also known as the intelligent transportation system5 (ITS) band. 

Adhering to the regulatory emissions required in the automotive industry, these PAs are being implemented on a new generation of intelligent driving systems with consumer-friendly, vehicle-to-vehicle (V2V) communications that will enhance safety on the road, optimise traffic patterns to reduce congestion, and improve the environment by reducing emission and gas consumption. 

AngelTech Live III: Join us on 12 April 2021!

AngelTech Live III will be broadcast on 12 April 2021, 10am BST, rebroadcast on 14 April (10am CTT) and 16 April (10am PST) and will feature online versions of the market-leading physical events: CS International and PIC International PLUS a brand new Silicon Semiconductor International Track!

Thanks to the great diversity of the semiconductor industry, we are always chasing new markets and developing a range of exciting technologies.

2021 is no different. Over the last few months interest in deep-UV LEDs has rocketed, due to its capability to disinfect and sanitise areas and combat Covid-19. We shall consider a roadmap for this device, along with technologies for boosting its output.

We shall also look at microLEDs, a display with many wonderful attributes, identifying processes for handling the mass transfer of tiny emitters that hold the key to commercialisation of this technology.

We shall also discuss electrification of transportation, underpinned by wide bandgap power electronics and supported by blue lasers that are ideal for processing copper.

Additional areas we will cover include the development of GaN ICs, to improve the reach of power electronics; the great strides that have been made with gallium oxide; and a look at new materials, such as cubic GaN and AlScN.

Having attracted 1500 delegates over the last 2 online summits, the 3rd event promises to be even bigger and better – with 3 interactive sessions over 1 day and will once again prove to be a key event across the semiconductor and photonic integrated circuits calendar.

So make sure you sign up today and discover the latest cutting edge developments across the compound semiconductor and integrated photonics value chain.



Search the news archive

To close this popup you can press escape or click the close icon.
Register - Step 1

You may choose to subscribe to the Compound Semiconductor Magazine, the Compound Semiconductor Newsletter, or both. You may also request additional information if required, before submitting your application.

Please subscribe me to:


You chose the industry type of "Other"

Please enter the industry that you work in:
Please enter the industry that you work in:
Live Event