Info
Info
News Article

Cree Introduces Industry's First 1.7-kV, All-SiC Power Module

Half-bridge module enables reductions in cost and size for high-power motor-drive and grid-tie inverter applications

Cree has released an all-SiC, 1.7kV power module in an industry-standard 62mm housing. Powered by the company's C2M large-area SiC chip technology, the new half-bridge module exhibits 8mΩ on-resistance and ten-times higher switching efficiency than existing Si module technology, capable of replacing Si IGBT modules rated at 400A or more.

The performance of the new 1.7kV all-SiC power module allows design engineers to simultaneously reduce the size and cost of magnetic and cooling elements while achieving superior system efficiency and reliability, says Cree. Unlike existing silicon-based systems in motor-drive, grid-tie and utility-scale-solar-inverter applications, the new Cree power module also enables lower production costs and the development of smaller, lighter products with a lower overall total cost of ownership.

"The introduction of Cree's all-SiC, 1700V power module opens the door for SiC devices to become the switching device of choice for high-power motor drives," said Devin Dilley, director of medium voltage R&D for Vacon, a global supplier in the premium AC drives market. "The application of these modules in SiC-based motor drives will enable a reduction in the size and cost of filter components by up to 40 percent while simultaneously increasing system efficiency."

The superior switching efficiency and voltage capability of this new module enables simplified, two-level topologies that are feasible at higher frequencies, eliminating the need to invest in complex, multi-level silicon-based solutions. The high power density that can be achieved with Cree's newest half-bridge module further simplifies the implementation of modular system designs and enables extremely low mean time to repair for high overall system availability.



AngelTech Live III: Join us on 12 April 2021!

AngelTech Live III will be broadcast on 12 April 2021, 10am BST, rebroadcast on 14 April (10am CTT) and 16 April (10am PST) and will feature online versions of the market-leading physical events: CS International and PIC International PLUS a brand new Silicon Semiconductor International Track!

Thanks to the great diversity of the semiconductor industry, we are always chasing new markets and developing a range of exciting technologies.

2021 is no different. Over the last few months interest in deep-UV LEDs has rocketed, due to its capability to disinfect and sanitise areas and combat Covid-19. We shall consider a roadmap for this device, along with technologies for boosting its output.

We shall also look at microLEDs, a display with many wonderful attributes, identifying processes for handling the mass transfer of tiny emitters that hold the key to commercialisation of this technology.

We shall also discuss electrification of transportation, underpinned by wide bandgap power electronics and supported by blue lasers that are ideal for processing copper.

Additional areas we will cover include the development of GaN ICs, to improve the reach of power electronics; the great strides that have been made with gallium oxide; and a look at new materials, such as cubic GaN and AlScN.

Having attracted 1500 delegates over the last 2 online summits, the 3rd event promises to be even bigger and better – with 3 interactive sessions over 1 day and will once again prove to be a key event across the semiconductor and photonic integrated circuits calendar.

So make sure you sign up today and discover the latest cutting edge developments across the compound semiconductor and integrated photonics value chain.

REGISTER FOR FREE

VIEW SESSIONS

Info
×
Search the news archive

To close this popup you can press escape or click the close icon.
×
Logo
×
Register - Step 1

You may choose to subscribe to the Compound Semiconductor Magazine, the Compound Semiconductor Newsletter, or both. You may also request additional information if required, before submitting your application.


Please subscribe me to:

 

You chose the industry type of "Other"

Please enter the industry that you work in:
Please enter the industry that you work in:
 
X
Info
X
Info
{taasPodcastNotification}
Live Event