Plessey Shows Large GaN-on-Si Die With Litecool's Heat Management
Plessey will be presenting the results of its partnership with Litecool, a Sheffield-based thermal solutions provider, to visitors during LuxLive, which takes place at ExCel in London from 19th to 20th November. Plessey will be showcasing its large area LED die assembled in the Litecool MicroSpot product.
Litecool develops and manufactures heat management solutions for LED lighting products. Its LED module allows the LED diodes to be mounted directly on to the heat spreader without anything underneath to obstruct the escaping heat. This offers lighting product designers an LED module that stays cooler allowing the use of smaller, lower cost heat sinks, according to the company.
The Plessey large area LED die is a 4.5 x 4.5mm design that will generate up to 5W of blue light over a 400-480nm wavelength range based on its GaN-on-Silicon MaGIC LED technology. Litecool has packaged the Plessey's single source LED emitter into its 10W MicroSpot package with the thermal resistance (junction to heat sink) of just 0.7C/W, producing a beam angle of 18 degrees and a luminance size of 42mm.
Litecool's CEO, James Reeves, said: "We have used our latest generation of technology to ensure ground breaking thermal resistance for this unique package. This powerful single source emitter works exceptionally well with secondary optics and with our technology keeping it cool. I can see this being a hit in the spotlight market where high lumen density is essential."
David Owen, Plessey's marketing director said: "Plessey's technology has already shown how we can overcome what up to now has been a significant cost barrier in large-scale LED illumination. The use of Litecool's LED module technology enables us to maintain the lumen density not just at source but at luminaire level - a 10W spotlight that is just 42mm in diameter."