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Cree adds 650V diodes to SiC Schottky portfolio

New diodes enable high efficiency power systems with improved reliability

Cree, a pioneer in SiC power devices, has added four new 650V diodes to its SiC Schottky diode portfolio. Developed in response to the power supply industry's recent demand for components with a nominal voltage rating slightly higher than 600V, the new 650V Cree Z-Rec SiC Schottky diodes enable high efficiency power systems with improved reliability, simplicity, and total cost.

Key characteristics of the new diodes include: zero reverse recovery current, high frequency operation with low EMI, temperature-independent switching behavior, reduced heat sink requirements, and significantly higher surge and avalanche capabilities. They also exhibit higher efficiency than comparable silicon diodes, with essentially no switching losses, and a positive temperature coefficient on VF enables parallel devices without thermal runaway.

The new 650V 6A C3D06065E, 8A C3D08065E, and 10A C3D10065E Cree Z-Rec diodes are supplied in TO-252-2 (DPAK) packages with a smaller footprint than many of the comparable diodes currently on the market. The 650V devices are suitable for use in switch mode power supplies, power factor correction, and motor drives, among other applications.

Additionally, these three diodes are automotive qualified to AEC-Q101, and are suitable for use in the power factor correction and onboard power electronic conversion systems of hybrid and electric vehicles.

The fourth new 650V diode, Cree's 6A, 650V C3D06065I internally isolated Z-Rec Schottky diode is an alternative to full-pack diodes and a complement to the existing and extremely successful 8A C3D08065I and 10A C3D10065I. Featuring a TO-220 package with internal ceramic insulation - unique to Cree with regard to SiC Schottky diodes - that provides 2.5kV isolation, Cree's new 6A, 650V internally isolated diode also provides greater operating ranges and capabilities than comparable full-pack devices, including significantly higher maximum temperatures and greater power dissipation.

Additionally, by eliminating the need to insert an external isolating sheet between the diode and heat sink, this new diode eases design, reduces cost, and supports the efficient manufacturing of HVAC, PFC, and switch mode power supplies.

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