Veeco Wins CS Innovation Award for multi-wafer tool
Veeco Instruments's TurboDisc EPIK700 GaN MOCVD System has won the Compound Semiconductor (CS) Industry Innovation Award for the highest distinction in compound semiconductor manufacturing over the last 12 months.
The CS Industry Innovation Award, which is based on an industry-wide nominating and voting process, recognizes success and development along the entire value chain of the compound semiconductor industry from research to completed device, focusing on the people, processes and products that drive the industry forward.
"We are honored to receive the CS Manufacturing Award for Innovation for the EPIK700 MOCVD system, particularly since the award was determined by a vote of our peers, LED customers and industry," said Jim Jenson, Senior Vice President, Veeco MOCVD. "The EPIK700 MOCVD system has the highest performance in the industry, reducing per wafer cost by up to 20 percent, and will play a significant role in the growing adoption of solid state lighting."
The Innovation Award was awarded for the most innovative outcome from compound semiconductor manufacturing and highlights products and processes that demonstrate the most innovative approaches for pushing the technical barriers during the last year.
In mid-March, the 2015 award was presented to Veeco's Sudhakar Raman, Vice President of Marketing, MOCVD at the CS International Conference in Frankfurt, Germany.
"Making LEDs with good margins is tough in the current environment," said Richard Stevenson, editor of Compound Semiconductor Magazine. "Increasing yield and productivity holds the key, making the latest multi-wafer tool from Veeco an attractive option."
This is the third time in four years that Veeco has won a major CS Industry Award. The TurboDisc MaxBright(r) Multi-Reactor MOCVD System was awarded the Compound Semiconductor Manufacturing Award in 2012 for the best innovative technology in compound semiconductor equipment. The GENxplor R&D MBE System won the Compound Semiconductor (CS) Industry Award for the biggest breakthrough in compound semiconductor manufacturing in 2014.
