More than 60 DOCSIS 3.1-ready products including gain blocks, power amplifiers, attenuators and switches on show in New Orleans

Qorvo will showcase its portfolio of DOCSIS 3.1 products at the upcoming SCTE 2015 Cable-Tec Expo in New Orleans. The next-generation standard for CATV systems, Data Over Cable Service Interface Specification (DOCSIS) 3.1 enables higher bandwidth to support increasingly data-intensive services such as high-definition TV and video-on-demand. 

Qorvo offers more than 60 DOCSIS 3.1-ready products, including pre-driver gain blocks, push-pull and power doubler amplifiers, attenuators and switches. These  use high-performance process technologies, including GaN HEMT technology.

"As cable operators migrate their systems over to DOCSIS 3.1, companies like Qorvo deliver the end-to-end backbone to make this transition go smoothly," said Jeff Heynen, research director, Broadband Access and Pay TV, IHS Technology. "It's important that all the key components are ready; growth will be notable beginning later this year and next year as DOCSIS 3.1 deploys, offering customers increasingly higher speeds."

"Qorvo is helping cable multi-system operators (MSOs) deploy infrastructure upgrades and achieve best-in-class DOCSIS 3.1 networking with the industry's broadest portfolio of high-performance DOCSIS 3.1 products," said Gorden Cook, general manager of Qorvo's Transport business unit. "Our DOCSIS 3.1 product portfolio supports transmission capacities of up to 1 Gbps upstream and a maximum of 10 Gbps downstream."

Qorvo's DOCSIS 3.1 forward path amplifiers operate from 45MHz to 1.2GHz, with high output (capable of 74dBmV composite power); low distortion levels (lower than 70dBc); and good input and output return loss (-20dB typical). Qorvo's reverse path amplifiers operate up to 300MHz with integrated attenuator and power down function. 

Qorvo's DOCSIS 3.1 products are packaged in SOT-115J, multi-chip module, and standard monolithic microwave integrated circuit (MMIC) packaging such as QFN, SOT89, or SOIC. Qorvo's MMIC products include gain amplifiers, low equivalent input noise current (EINC) trans-impedance amplifiers (TIA), attenuators, switches, filters, and complete optical receivers for RF over glass (RFoG) and passive optical network (PON) applications. 

Qorvo will be exhibiting at the SCTE 2015 Cable-Tec Expo in New Orleans, LA, from October 14, 2015, through October 16, 2015.

AngelTech Live III: Join us on 12 April 2021!

AngelTech Live III will be broadcast on 12 April 2021, 10am BST, rebroadcast on 14 April (10am CTT) and 16 April (10am PST) and will feature online versions of the market-leading physical events: CS International and PIC International PLUS a brand new Silicon Semiconductor International Track!

Thanks to the great diversity of the semiconductor industry, we are always chasing new markets and developing a range of exciting technologies.

2021 is no different. Over the last few months interest in deep-UV LEDs has rocketed, due to its capability to disinfect and sanitise areas and combat Covid-19. We shall consider a roadmap for this device, along with technologies for boosting its output.

We shall also look at microLEDs, a display with many wonderful attributes, identifying processes for handling the mass transfer of tiny emitters that hold the key to commercialisation of this technology.

We shall also discuss electrification of transportation, underpinned by wide bandgap power electronics and supported by blue lasers that are ideal for processing copper.

Additional areas we will cover include the development of GaN ICs, to improve the reach of power electronics; the great strides that have been made with gallium oxide; and a look at new materials, such as cubic GaN and AlScN.

Having attracted 1500 delegates over the last 2 online summits, the 3rd event promises to be even bigger and better – with 3 interactive sessions over 1 day and will once again prove to be a key event across the semiconductor and photonic integrated circuits calendar.

So make sure you sign up today and discover the latest cutting edge developments across the compound semiconductor and integrated photonics value chain.

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