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News

News

Monday 30th March 2026

Fujitsu develops first 1Mpixel dual-band T2SL infrared sensor

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Monday 30th March 2026

QuantumDiamonds expands into Asia

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Thursday 26th March 2026

Tiny LED design could shrink next-gen systems

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Thursday 26th March 2026

Aixtron to build new plant in Malaysia

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Thursday 26th March 2026

Glasgow nanofabrication facility marks 20 years of achievement

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Wednesday 25th March 2026

Power Roll announces Japanese perovskite PV project

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Wednesday 25th March 2026

Taiwan Semi introduces 1200V SiC rectifiers in SOD-128

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Wednesday 25th March 2026

Polar Light Technologies wins €1.1m EU grant

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Wednesday 25th March 2026

Perovskite solar cells are resilient to dust during production

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Wednesday 25th March 2026

‘Smart stamp’ offers new way to transfer microLEDs

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Wednesday 25th March 2026

Renesas unveils bidirectional 650V GaN switch

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Tuesday 24th March 2026

Infineon and DG Matrix use SiC to drive SST technology

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Tuesday 24th March 2026

Power Integrations extends flyback topology to 440W

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Monday 23rd March 2026

Warwick University to boost WBG chip reliability testing

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Monday 23rd March 2026

EPC introduces GaN-based BLDC motor drive board

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Monday 23rd March 2026

K-Space signs new European representative

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Monday 23rd March 2026

SemiQ launches 1200V half-bridge module family

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Monday 23rd March 2026

Diamond power switch shatters performance records

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Monday 23rd March 2026

Infineon partners with Zenergize on India-designed power-electronics

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Monday 23rd March 2026

OXIDE and Vexlum sign UV laser partnership

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Monday 23rd March 2026

Get ready for CS International: 20 - 22 April 2026

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Friday 20th March 2026

EPC releases eGaN Phase 18 reliability report

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Thursday 19th March 2026

Hensoldt signs GaN supply deal with UMS

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Thursday 19th March 2026

STM expands 800 VDC power conversion portfolio