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Tuesday 31st July 2012
LayTec have confirmed they will be platinum sponsors at the Compound Semiconductor industry's premier international event, CS International, which will held in Frankfurt, Germany on 4th & 5th March 2013.
Monday 30th July 2012
The manufacturing software promises to simplify the system complexities inherent in running sophisticated wafer and cell processing.
Monday 30th July 2012
Solar Junction and RF Micro deals provide “powerful platform for continuing growth and cash generation,” says UK wafer maker.
Monday 30th July 2012
The semiconductor manufacturer plans to reach full production of high brightness LEDs by the second quarter of next year.
Friday 27th July 2012
LED manufacturer hopes to capture more of the growing Asian market with new, Taiwan-based office.
Friday 27th July 2012
Researchers from the University of Texas have demonstrated a green, gallium nitride, nano-rod laser that operates below the three-dimensional optical diffraction limit
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Thursday 26th July 2012
Oxford Instruments have confirmed they will be Platinum sponsors at the Compound Semiconductor industry's premier international event, CS International, which will held in Frankfurt, Germany on 4h & 5th March 2013.
Thursday 26th July 2012
The Japan-based electronics heavyweight will construct a new LED production line at its 200mm wafer fab in northern Japan, to ramp up production.
Thursday 26th July 2012
Increased Order Intake and profitability expected to return within H2/2012
Thursday 26th July 2012
Oxford Instruments supply system which will run GaN on Si etch processes
Thursday 26th July 2012
CS International are pleased to announce Frank Schulte, Vice President, Aixtron Europe has been confirmed as a guest speaker for the Compound Semiconductor industry's premier international event, CS International, which will held in Frankfurt, Germany on 4th & 5th March 2013.
Thursday 26th July 2012
US chipmaker blames weak results on slow mobile device demand
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Thursday 26th July 2012
Siemens will spin off its lighting unit Osram in early next year, says chief executive Peter Loescher
Wednesday 25th July 2012
Anadigics dual-band power amplifiers promise exceptional performance and integration for the Samsung Galaxy S III smartphone
Wednesday 25th July 2012
The latest power amplifiers are designed to be used in wireless infrastructure applications including base station transceivers and next-generation wireless network transceivers.
Wednesday 25th July 2012
GaN Systems and Converter Technology plan to deliver application support for advanced power control and conversion GaN applications
Wednesday 25th July 2012
Markets and Markets predicts the next decade will see the GaN power semiconductor market top $1.75 billion, thanks to myriad new applications.
Wednesday 25th July 2012
Local government awards Euro 2.6 million to Azzurro for large wafer development
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Wednesday 25th July 2012
Veeco announced today that Azzurro, involved in GaN-on-Si technology headquartered in Germany, has recently placed into production the TurboDisc® K465i™ gallium nitride Metal Organic Chemical Vapor Deposition System.
Tuesday 24th July 2012
Semiconductor equipment manufacturer, Aixtron, develops gallium nitride on silicon technology for its AIX G5 platform
Tuesday 24th July 2012
GaN technology boosts communications performance as military invests in next generation systems, reports Strategy Analytics
Tuesday 24th July 2012
Telecom and datacom businesses hope to create a new leader in the optical industry
Tuesday 24th July 2012
Ocean Thin Films qualifies Veeco’s Spector-HT IBD system for high volume production
Monday 23rd July 2012
Taiwan-based GaN chip maker, Genesis Photonics, to complete production of China plant by the third quarter of this year

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