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Thursday 13th July 2023
Inseto supplies tools to UK Institute for Compound Semiconductors
Thursday 13th July 2023
Toshiba launches 650V SiC Schottky barrier diodes
Thursday 13th July 2023
ClassOne secures order from Menlo Microsystems
Thursday 13th July 2023
UK start-up signs MOUl with GaN Systems
Wednesday 12th July 2023
Rohm acquires site to expand SiC production
Wednesday 12th July 2023
SMART Photonics secures €100 million extra funding
Wednesday 12th July 2023
MICROOLED raises €21 million
Tuesday 11th July 2023
Taiyo Nippon Sanso releases GaN MOCVD system
Tuesday 11th July 2023
Improving the RF performance of β-Ga2O3 FETs
Monday 10th July 2023
GaN patent wars webinar 20th July
Thursday 6th July 2023
Transphorm confirms GaN sources are secure
Thursday 6th July 2023
Rohm announces RGB chip LED for car interiors
Thursday 6th July 2023
MIT team grows arrays of perovskite nanoLEDs
Thursday 6th July 2023
Micro-transfer printing for heterogeneous PICs
Thursday 6th July 2023
GaN chip firms confirm continued supply
Thursday 6th July 2023
3D-Micromac shows latest tools at Semicon West
Thursday 6th July 2023
From atoms to new materials
Wednesday 5th July 2023
Renesas and Wolfspeed sign 10 year SiC wafer agreement
Tuesday 4th July 2023
China to put export controls on compound semi materials
Tuesday 4th July 2023
Advancing the InGaAs MOSFET
Monday 3rd July 2023
Indian GaN centre installs Oxford Instruments tools
Monday 3rd July 2023
NexGen and General Motors get DOE grant
Monday 3rd July 2023
DISCO develops KABRA process for GaN wafers
Monday 3rd July 2023
OnePlus uses Innoscience bidirectional VGaN HEMTs
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