News Article
RFMD announces Selex compound semiconductor collaboration
RFMD to develop new GaAs MMIC electronically-scanned phased array radar system.
RF Micro Devices (RFMD) has announced an extension to their partnership with Selex Galileo to develop a new high-frequency GaAs MMIC electronically-scanned phased array radar system.
The two companies have been working together on the project since May 2008. However, the scheme is about to get into a production phase and as such, each of the businesses is now looking forward to continuing collaboration to get the product to market.
Jeff Shealy, vice-president and general manager of RFMD s Defense and Power business unit, said: "We are pleased to support Selex Galileo s high-frequency GaAs requirements using our GaAs technical expertise and high volume commercial wafer fab."
RFMD is set to manufacture the high-frequency GaAs MMIC compound semiconductors on six-inch substrates at its UK-based high-volume GaAs wafer fabrication plant in Durham.
The company is traded on the Nasdaq Global Select Market under the symbol RFMD and presently has a share price of $4.21 (£2.81 - Feb 26th, 16:01 EST).
The two companies have been working together on the project since May 2008. However, the scheme is about to get into a production phase and as such, each of the businesses is now looking forward to continuing collaboration to get the product to market.
Jeff Shealy, vice-president and general manager of RFMD s Defense and Power business unit, said: "We are pleased to support Selex Galileo s high-frequency GaAs requirements using our GaAs technical expertise and high volume commercial wafer fab."
RFMD is set to manufacture the high-frequency GaAs MMIC compound semiconductors on six-inch substrates at its UK-based high-volume GaAs wafer fabrication plant in Durham.
The company is traded on the Nasdaq Global Select Market under the symbol RFMD and presently has a share price of $4.21 (£2.81 - Feb 26th, 16:01 EST).
Connecting the Compound Semiconductor Industry
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The 13th CS International conference builds on the strengths of its predecessors, with around 40 leaders from industry and academia delivering presentations that fall within five key themes: Ultrafast Communication; Making Headway with the MicroLED; Taking the Power from Silicon, New Vectors for the VCSEL, and Ultra-wide Bandgap Devices.
Delegates attending these sessions will gain insight into device technology, find out about the current status and the roadmap for the compound semiconductor industry, and discover the latest advances in tools and processes that will drive up fab yields and throughputs.
To discover our sponsorship and exhibition opportunities, contact us at:
Email: info@csinternational.net
Phone: +44 (0)24 7671 8970
To register your place as a delegate, visit: https://csinternational.net/register
Register
