Oxford Instruments announces InP tool orders
Tier 1 customers move to higher automation and increased die per wafer
Oxford Instruments has announced a series of orders for its ICP InP etch processing solutions from Tier 1 European and Asian optical module and integrated device manufacturers.
Oxford Instruments is seeing a transition to higher automation and increased die per wafer, which it is supporting with its high temperature electrostatic clamping (Hot ESC) for the PlasmaPro 100 Cobra ICP etch module, part of the ICP InP etch processing solutions.
The Hot ESC capability from 75 mm wafer size and up, is a full automation-compatible solution, which reduces manual processing for increased reliability and repeatability, which is critical at larger wafer sizes and with more complex processes.
Oxford Instruments will be attending Photonics West 2023 (31st Jan to 2nd feb in San Francisco) to share the latest advances in optoelectronics, photonics, laser and quantum.
