Aehr receives $23M follow-on orders for SiC test equipment
Orders include a significant number of FOX WaferPak full wafer Contactors
Aehr Test Systems has announced that it has received new follow-on orders totalling $23 million from existing customers for FOX wafer level test and burn-in products to be used for production and engineering qualification needs for wafer level burn-in and screening of SiC devices.
According to the company, the orders include a significant number of FOX WaferPak full wafer Contactors for both current design capacity increases as well as new device designs that are expected to drive additional orders in calendar year 2024 and beyond.
FOX WaferPak Contactors are used in conjunction with the company’s FOX-NP and FOX-XP wafer level test and burn-in systems to contact 100 percent of the die on a wafer up to several thousand devices at a time. These proprietary WaferPak designs are specific to a customer’s application as well as die layout and unique electrical contact pads.
Aehr’s FOX systems and WaferPaks are currently being used on wafer sizes ranging from 4, 6, 8 and 12inch wafers and can be configured for a wide range of device applications.
The FOX-XP and FOX-NP systems and proprietary WaferPaks are capable of functional test and burn-in/cycling of SiC and GaN power semiconductors, silicon photonics integrated circuits as well as other optical devices, 2D and 3D sensors, flash memories, magnetic sensors, microcontrollers, and other ICs in either wafer form factor before they are assembled into single or multi-die stacked packages, or in singulated die or module form factor.
