EVG highlights 3D integration at SEMICON Taiwan
Presentations to highlight capabilities of lithography, bonding and IR laser solutions for heterogeneous integration
EV Group (EVG) will highlight key advances in hybrid and fusion wafer bonding, IR laser layer release technology, and lithography for semiconductor and micro-electronics manufacturing and packaging at the SEMICON Taiwan 2024 expo in Taipei, Taiwan on September 4-6 2024.
EVG speakers will present on the LITHOSCALE system for chiplet packaging (Wednesday, September 4th, 2pm) and trends in hybrid bonding (Friday, September 6th, 2:25pm)
Kuo Yin-Chuan, process technology engineer at EV Group Taiwan, will give a presentation titled Maskless Patterning Solution for Multi-functional Chiplets in Advanced System-in-Package (SiP). He will focus on EVG's LITHOSCALE maskless exposure system and explains how it overcomes the severe limitations of mask-based optical lithography systems in the development of next-generation advanced packaging technologies, such as inaccuracies from die placement and die shift variations caused by over-moulding, and limited exposure areas in large-die interposer fabrication.
Thomas Uhrmann, director of business development at EVG, will be presenting on Disruptive 3D Integration Technologies for Advanced Stacked Systems. In this talk Uhrmann will give an overview on the current industry trends and technological developments for both wafer-to-wafer and die-to-wafer hybrid bonding. He will discuss key technology differentiators and integration scenarios with respect to the hybrid bonding schemes in combination with IR laser-based carrier solutions, that enable disruptive device flows for ultra-thin 3D devices.
EVG has significantly grown its presence in Taiwan to better serve customers and partners in the region. This includes expanding its local offices in Hsinchu, Taichung and Tainan, particularly in Taichung where EVG has added to its process and application engineering team as well as to its sales and service personnel.
This past April, EVG also hosted a Technology Day event in Hsinchu with the theme AI, Edge Computing, Hyperconnectivity: Pioneering the Future of Semiconductor Innovation, featuring presentations and talks from EVG, market analysts, and industry partners Applied Materials, ASMPT, and the Industrial Technology Research Institute (ITRI).
According to EVG, this year’s EVG TechDay Taiwan was among its most successful in the region to date, breaking a record high triple-digit attendance.
