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Scintil raises $58m to scale integrated photonics tech

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Funding for CEA-Leti spin-out will support commercial ramp of single-chip DWDM light engine integrating multi-wavelength lasers

Scintil Photonics, a Grenoble-based spin-off from CEA-Leti, has announced the completion of a $58 million (€50m) Series B funding.

The round was led by Yotta Capital Partners and NGP Capital, with participation from NVIDIA. It includes new participation from BNP Paribas Développement, alongside existing investors including Supernova Invest, Bpifrance Digital Venture, Innovacom, Bosch Ventures, Applied Ventures ITIC Innovation Fund (AVITIC).

Scintil’s SHIP (Scintil Heterogeneous Integration Photonics) process technology enables the integration of multiple optical devices, including lasers, photodiodes, and modulators, on a single chip. Since its inception, Scintil has developed the SHIP platform on a commercial supply chain with mass manufacturing capabilities.

The funding supports the commercial ramp of LEAF Light, a single-chip DWDM-native light engine that integrates multi-wavelength lasers. Built on the SHIP platform, LEAF Light delivers 6.4 Tbps/mm edge bandwidth density at roughly one-sixth the power consumption of conventional pluggable solutions. It’s designed for scale-up GPU clusters and emerging AI systems, with reference packaging and integration support to accelerate deployment.

“This investment marks a pivotal moment for Scintil as we move to full-scale deployment,” said Matt Crowley, CEO of Scintil Photonics. “Our SHIP technology enables integrated photonic solutions with the scalability, energy efficiency, and integration density required to power next-generation compute infrastructure. This efficiency not only reduces data centre operating costs but also contributes to lowering the carbon footprint of AI infrastructure. With LEAF Light entering high-volume production, we’re expanding from our base in Grenoble into the international markets, including the US, to support the world’s most advanced AI factories.”

“We developed our LEAF Light integrated circuit in close collaboration with our customers. Used as an external laser source for Co-Packaged Optics (CPO) transmissions, it is a key component for the next generation of AI data centres. Its uniqueness lies in a single-chip solution that monolithically integrates precisely spaced DFB lasers on silicon photonic circuits, produced through a robust commercial supply chain,” said Sylvie Menezo, founder and CTO of Scintil Photonics.

“Scintil exemplifies the kind of innovation leaders we look for, combining advanced manufacturing, deep-tech leadership, and meaningful impact on the energy demands of AI infrastructure,” said Vincent Deltrieu, managing partner at Yotta Capital Partners. “Scintil’s integrated photonics platform is essential to scale the next generation of AI factories. We’re excited to support their global growth as they move to high-volume shipments.”

“Integrated photonics is becoming a foundation of all AI infrastructure, and Scintil is turning that future into reality,” said Bo Ilsoe, managing partner at NGP Capital. “Their technology delivers the bandwidth density and energy efficiency AI factories require with global scalability. We’re excited to support Scintil as they scale deployments and become a leading player in building the next wave of compute and data infrastructure.”

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