VisIC announces $26M investment backed by Hyundai
GaN power chip company VisIC Technologies has announced the successful second closing of its Round B funding, securing $26million. The round was led by a global semiconductor leader, with car companies Hyundai and Kia (HKMC) joining as a strategic investor.
The lead investor's focus on advancing critical semiconductor technologies complements VisIC's proprietary D³GaN platform, designed to deliver efficiency, scalability, and reliability for automotive drivetrains. HKMC's participation underscores its commitment to integrating GaN technology into mass-production EV platforms.
VisIC says the new capital will accelerate its roadmap, including: optimisation, qualification, and release of Gen3 750V GaN dice and power modules; cevelopment of Gen4 1350V GaN technology, supporting the full spectrum of EV designs; stabilisation of the supply chain and ramp-up of GaN product delivery for EV traction inverters; and expansion into emerging 800V data centre power requirements, leveraging the same advanced GaN platform.
Tamara Baksht, CEO of VisIC Technologies said: "This investment marks a major milestone for VisIC and the global EV industry. Our D³GaN technology is redefining power electronics for electric vehicles, and the support of our strategic partners accelerates our mission to deliver high-efficiency, scalable solutions for the next generation of mobility."
Hyundai Motor Company and Kia (HKMC) said: "Hyundai Motor Company and Kia are committed to advancing sustainable mobility. Partnering with VisIC enables us to integrate cutting-edge GaN power technologies into our EV platforms, enhancing efficiency, reliability, and performance as we shape the future of electric transportation."
