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SemiQ to debut latest SiC modules at APEC 2026

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Company to exhibit QSiC Gen3 line featuring 1200V SOT-227, S3 half-bridge, B2T1 six-pack and B3 full-bridge packages

SemiQ Inc, a developer of SiC solutions, will debut its latest SiC module advances at the 2026 Applied Power Electronics Conference (APEC) from March 22nd to 26th, at the Henry Gonzalez Convention Center, San Antonio, Texas.

These modules have been designed to deliver compact and efficient solutions for active front ends (AFE) and the high‑performance compressor units used in advanced data centre cooling systems.

The new lineup has been engineered to meet the rising power and thermal demands of AI-driven data centres, high-power industrial, and EV applications, and will be on display at the company's booth throughout the show.

Product highlights

Visitors to the SemiQ booth will be able to see the company’s latest QSiC Gen3 SiC modules, which feature a 30 percent reduction in specific on-resistance (RONsp) and turn off energy losses (EOFF) versus its previous generations. These modules are said to significantly reduce cooling complexity and switching losses for EV charging stations, energy storage systems, and industrial motor drives.

With additional advances including:

- S3 Modules: This family includes a 608 A half-bridge module with an ultra-low 2.4 mΩ RDSon and a junction-to-case thermal resistance (RθJC) of just 0.07ºC/W.

- SOT-227 Modules: Featuring five modules with RDSon values of 7.4, 14.5, and 34 mΩ, optimised for server power supplies, battery chargers and PV inverters.

- B2T1 Six-Pack Modules: Spanning an RDSon range of 19.5 to 82 mΩ designed to minimise parasitics in motor drives and advanced AC-DC converters.

- B3 Full-Bridge Modules: Delivering up to 120 A with RDSon as low as 8.6 mΩ. These modules maximise power density for high-voltage DC-DC systems.

“These SiC technologies directly address the challenges faced by those implementing AI infrastructure,” said Timothy Han, president at SemiQ. “By improving efficiency, and addressing the escalating power demands of data centres across key application areas, we are expanding the potential for AI to scale sustainably.”

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