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EiC Receives ISO-9001 Certification For Its Fremont Headquarters

Fremont, CA. Committed to the total quality management (TQM) concept, EiC has announced that it has received ISO-9001 certification as of February 22, 2000 for its Fremont headquarters. EiC maintains its product design team, 4-in GaAs HBT (Heterojunction Bipolar Transistor) wafer fab line, and production test functions at this facility. After 8 months of internal and third party auditing, EiC passed the final audit and gained recommendation for certification as of December 1999.

"It is the policy of EiC Corporation to provide long lasting and reliable components for the wireless communications market," states the EiC Quality Policy Manual. "The company focuses on customer satisfaction and strategic partnerships to ensure success."

"We are very pleased and proud to be certified by SGS Yarsley International Certification Services having satisfied the requirements of ISO 9001," said Dr. Nicky Lu, President of EiC Corporation and a member of the National Academy of Engineering. "All EiC employees deserve a heartfelt congratulations for the hard work they put in to attain this status."

"In achieving ISO 9001 registration, EiC Corporation joins an impressive international list of companies that are recognized worldwide for their competence in design, manufacturing, and service," commented Kenneth Murray, Quality Assurance Manager for EiC Corp. "We believe that achieving this certification has improved our internal systems and controls, demonstrates our ongoing commitment to quality and is a significant milestone in our mission to provide first rate products and services to all our customers." SGS Yarsley ICS has been accredited by United Kingdom Accreditation Service (UKAS).

EiC Corporation, ISO-9001 certified, is an RF integrated circuit (RFIC) company specializing in the development of GaAs HBT components for commercial applications such as wireless handsets and infrastructure systems down to 3 Volts. The company s product line is comprised of a full range of RF building block components, including broadband amplifiers, driver amplifiers, LNA with down converters, up converters, gain blocks for the 0 to 3GHz spectrum, and power amplifiers (PA) in the 800-950MHz band and the PCS band. These products, which are manufactured in high-volume standard lots at the Fremont site, are targeted at a wide range of wireless markets, including the 900MHz ISM band and the 2.4GHz ISM band for both direct sequence and frequency hopping spread spectrum technologies. Also targeted are various standards and applications in cellular and PCS bands, such as AMPS, CDMA, TDMA, GSM, CDPD, and WLL. For more information, visit the EiC Corporation home page at www.eiccorp.com.

Contact:
EiC Corporation
Dr. Barry Lin, 510/979-8940
E-mail: sales@eiccorp.com

 

EiC Corporation
Dr. Barry Lin, 510/979-8940
E-mail: sales@eiccorp.com
 
E-mail: sales@eiccorp.com
Web site: http://www.eiccorp.com
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