BRUSH WELLMAN INTRODUCES RF705 COPPER CUPACK (R) PACKAGE
NEWBURYPORT, MA. Brush Wellman (NYSE-BW), Electronic Packaging Group, (a business unit of Electronic Products Division) extends its industry leading copper CuPack (R) product line with the introduction of the RF705 package. Aimed at the high power dissipation requirements of 2 ½ and 3G systems, the package is ideal for Si, SiC, GaAs, GaN, and other semiconductor materials. The RF705 is an industry standard, single ended outline, manufactured with high performance copper/tungsten to permit exceptional power densities. Power dissipation of the RF705 is up to 150 watts or more, and it is available in both flanged and flangeless versions.
Bob Pomerleau, general manager of Brush Wellman s Electronic Packaging Group stated "The RF705 uses an enhanced copper/tungsten to achieve its exceptional electrical and thermal performance. This package represents our continued commitment to offer designers enabling solutions to their power dissipation requirements."
Brush Wellman Inc. is a wholly-owned subsidiary of Brush Engineered Materials Inc. (NYSE-BW). Brush Engineered Materials Inc. headquartered in Cleveland, Ohio, is a manufacturer of engineered materials. The Company supplies worldwide markets with Beryllium Products, Alloy Products, Electronic Products, Precious Metal Products and Engineered Materials Systems.
FOR FUTHER INFORMATION OR SAMPLES, PLEASE CONTACT:
Brian Simmons
Product Manager
Brush Wellman
PH : (978) 463-6553
Email: brian_simmons@brushwellman.com
or
Christine Brown
Account Representative, Brush Wellman
PH: (978) 463-6553
Email: christine_brown@brushwellman.com
Brian Simmons
Product Manager
Brush Wellman
PH : (978) 463-6553
Email: brian_simmons@brushwellman.com
or
Christine Brown
Account Representative, Brush Wellman
PH: (978) 463-6553
Email: christine_brown@brushwellman.com
E-mail: christine_brown@brushwellman.com
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