IBM and Multilink Technology Corporation to collaborate on high-speed network communications solutions
IBM and Multilink Technology Corporation (Multilink) today announced an agreement under which the two companies will jointly develop high-speed components for data and telecommunications applications.
The two companies will work together to combine IBM s advanced silicon germanium (SiGe) and CMOS technologies with Multilink s expertise in the complete design and manufacture of integrated circuits, modules and subassembly boards used in communications. The work will involve joint development of components and reference designs for high speed transport layer 10 and 40 Gigabit SONET (Synchronous Optical Network), SDH (Synchronous Digital Hierarchy) and Ethernet networks.
"The continued growth of e-business depends upon advancements in semiconductor technologies, like IBM s SiGe, to enable high-speed network connectivity," said Christine King, Vice President of Networking Technology for IBM. "By working with Multilink, we intend to complement our custom logic, network processor and embedded PowerPC products with new high performance communications chips that will dramatically improve our customers time-to-market."
Given the accelerated growth of Internet traffic, network equipment makers are searching for new technologies that can enable high-speed communications and improve the performance of both existing and future networks. Innovative design and development teams, combining IBM s advanced microchip technology with Multilink s system knowledge, will work together to optimise product solutions that position both companies a step ahead of the communication industry s technology demands.
"Multilink s Solutions with Systems Knowledge include physical and data- layer components incorporating advanced functionality to support operation in today s real- world DWDM systems," stated Dr. Richard Nottenburg, President and CEO of Multilink.
"More than just a component supplier, Multilink products include the technical support, design integration, system compatibility and overall functionality our customer s need to meet the demands of today s time-to-market requirements and tomorrow s technological advancements. Combining all this with IBM s leadership in semiconductor processes will quickly further our mutual goal of enabling Internet infrastructure technologies."
With this announcement, IBM is making its advanced semiconductor technologies available to Multilink. IBM will manufacture the chips in its Burlington, VT plant. In addition, IBM has taken a minority equity stake in Multilink.
About IBM
IBM Microelectronics is a key contributor to IBM s role as the world s premier information technology supplier. IBM Microelectronics develops, manufactures and markets state-of-the-art semiconductor technologies, products, packaging and services. Its superior integrated solutions can be found in many of the world s best-known electronic brands. More information about IBM Microelectronics can be found at www.chips.ibm.com.
About Multilink Technology Corporation
Multilink Technology Corporation is a leader and innovator in the design, manufacturing and sales of integrated circuits, modules and board level subsystems for the telecommunications and data communications industries. Its products are designed to improve both the speed and performance of fiber optic networks. The company is headquartered in Somerset, New Jersey U.S.A. with additional U.S.A. operations in California. European offices are headquartered at Multilink Technology GmbH in Bochum Germany and supported with an office in Vilnius Lithuania. More information about Multilink is available at www.mltc.com.
CONTACT: Rupert Deighton, IBM Technology Group
Tel: +41 79 44 82 747
e-mail: rupertmicro@fr.ibm.com
Adam Keal, IBM
Tel: +44 (0)207 345 3307
e-mail: adam.keal@uk.ogilvypr.com
Nick Robinson, IBM
Tel: +44 (0)207 345 3311
e-mail: nick.robinson@uk.ogilvypr.com
Robyn Gross, Multilink Technology Corporation
Tel: +1 732 537-3752
e-mail: rgross@mltc.com
Rupert Deighton,
IBM Technology Group
Tel: +41 79 44 82 747
e-mail: rupertmicro@fr.ibm.com
Adam Keal, IBM
Tel: +44 (0)207 345 3307
e-mail: adam.keal@uk.ogilvypr.com
Nick Robinson, IBM
Tel: +44 (0)207 345 3311
e-mail: nick.robinson@uk.ogilvypr.com
Robyn Gross, Multilink Technology Corporation
Tel: +1 732 537-3752
e-mail: rgross@mltc.com
E-mail: rgross@mltc.com
Web site: http://www.mltc.com
