Suss Adds Gyrset Cover to Proven Falcon Coating Technology
San Francisco, CA. Karl Suss announced that its Falcon microlithography coating cluster system is now configured for thick resist processing, which enables the tool to perform back end packaging applications. The Falcon is now capable of running processes from very basic non-critical dimension research all the way through to the high density requirements of 256M DRAM.
Adding the Gyrset cover as an option to the Falcon system allows Karl Suss to refocus its proven technology on the thick resist film market with its ability to coat 60 to 100 microns of thick resist in a single pass. The closed cover feature changes the coating paradigm by capturing the casting solvent from the dispensed polymer, enhancing the coating process and results and minimizing the need for expensive and bulky controls. Finally, the closed cover chuck excludes air turbulence from the process chamber yielding a uniform, consistent coating thickness without the usual spinning defects such as rebounding, splash-back, striations, comets or corner effects. These processing modifications result in improved wafer to wafer and across the wafer uniformity and a reduction in resist consumption by up to 50 percent.
"The ability to produce thick resist films is of increasing importance for next-generation technologies. These technologies, such as flip chip, chip scale packages and MEMS require thick resist layers in order to pattern solder balls and deep structures," explained James Hermanowski, international product manager for Suss Coating Business. "Adding the Gyrset cover to the proven Falcon technology allows us to meet the needs of the advanced packaging markets. The Falcon is a unique and versatile tool and, with the Gyrset cover, offers our customers the most comprehensive and highest-performing packaging solutions."
The Gyrset cover also allows Karl Suss to perform a number of new applications not previously available for the Falcon. These capabilities include the ability to: coat extremely thin resists uniformly without defects; spin-planarize low k dielectrics to minimize CMP; coat over topography such as bumps and trenches; and coat square substrates such as advanced DUV photomasks and exotic masks used for x-ray and SCALPEL lithography techniques.
A modular cluster tool for coating, bake and develop, the Falcon offers high throughput in complex processes requiring multiple coats. This capability makes the Falcon ideal for mainstream IC production, GaAs and advanced packaging applications. The tool s modular nature means that is can be purchased in multiple configurations and can be integrated seamlessly into many processes at a low price or configured with many process stations to best meet the customer s needs at the lowest possible cost.
About Karl Suss
Karl Suss is a global supplier of manufacturing equipment and process technology for the advanced packaging, MEMS and microelectronics markets. With over 6,000 systems installed, SUSS products include coating and developing systems, proximity lithography systems, substrate bonders, flip chip bonders and probe systems. Headquartered in Munich/Germany, Suss operates 9 manufacturing, sales and service centers in North America, Europe, Asia and Japan. To learn more about Karl Suss and its full line of products, please visit the company s web site at www.suss.com or www.suss.de.
Contact: James Hermanowski of Karl Suss America Inc., Tel: 802-244 5181; fax: 802-244-5103, jhermano@suss.com; or Steve Farnsworth of Mathews and Clark Communications Tel: 650-815-1006; fax: 650-815-1095 steve@mathewsandclark.com for Karl Suss America Inc.
James Hermanowski of Karl Suss America Inc.,
Tel: 802-244 5181; fax: 802-244-5103,
jhermano@suss.com;
or
Steve Farnsworth of Mathews and Clark Communications
Tel: 650-815-1006; fax: 650-815-1095
steve@mathewsandclark.com for Karl Suss America Inc.
E-mail: steve@mathewsandclark.com
Web site: http://www.suss.com
