10Gb/s Electroabsorption Modulator Driver from Vitesse
Source: Vitesse Semiconductor
Device Offers Advantages to SONET/SDH and WDM Communications Designers
Camarillo, CA. Vitesse Semiconductor Corporation (NASDAQ:VTSS) today introduced the VSC7991, an OC-192 electroabsorption modulator (EAM)/laser diode driver for optical telecom and datacom equipment manufacturers. The VSC7991 operates at data rates up to 10.7Gb/s, accommodating the overhead required for Forward Error Correction (FEC). Its 3Vpp output swing enables excellent electroabsorption modulator driver eye-characteristics.
The 50-ohm resistive back-termination of the differential outputs of the VSC7991 simplifies impedance matching to the driven optical device. This integrated circuit performs seamlessly with Vitesse s extensive line of 10Gb/s SONET/SDH multiplexer ICs, such as the VSC8171, as demonstrated in the available reference design from Vitesse.
The VSC7991 has rise and fall times of less than 35ps and very low jitter. It requires a single 6.5V supply and operates over the temperature range from -40° to +85°C. The maximum current delivered to the load is 65mA. The controls for the bias and modulation currents are directly accessible to external circuitry, allowing precise monitoring and setting of the current levels to compensate for changes in the characteristics of the laser or modulator over its operating lifetime. The VSC7991 dissipates less than 2W even when supplying the maximum modulation current to the load. Internally differential terminated data inputs (50 Ohms) simplify board layout.
"The combination of fast edge rates and low input and output signal reflection at 10.7Gb/s provide excellent eye-pattern characteristics and margin for both long and short reach OC-192 transmitter designs," stated Ray Milano, vice president of optoelectronic products at Vitesse. "The full 3V output voltage swing makes it the device of choice for all electroabsorption modulator applications," concluded Milano.
The VSC7991 is available in die form, further reducing overall system cost and reducing board space requirements or in a 32-pin glass walled flat pack. All die are tested using an automated custom high frequency probe environment developed by Vitesse. Die are delivered in waffle packs to maintain the mechanical integrity of the individual chips. Pricing of the VSC7991 in a 32-pin metal-glass package is less than $200 in quantities of 5000 units.
Vitesse Semiconductor Corporation is the leading designer and supplier of innovative, high performance semiconductors utilizing state-of-the-art processes for the manufacturers of next generation DWDM and optical networking communications equipment. Vitesse also develops storage area networking ICs and enclosure management products that monitor and communicate critical reliability and availability information. The company s products address the needs of Core, Access, Optical and Enterprise network equipment manufacturers who demand a combination of high speed, high complexity and low power dissipation. Vitesse is headquartered in Camarillo, California, and operates two fabrication facilities in Camarillo and Colorado Springs.
Company/product information can be found on the web at www.vitesse.com.
Vitesse Editorial Contacts:
Patricia Ito Vitesse Semiconductor (805) 388-3700 ito@vitesse.com
Caroline Melnicoff CMC Public Relations (650)324-8819 cmp1@earthlink.net
Patricia Ito
Vitesse Semiconductor
(805) 388-3700
ito@vitesse.com
Caroline Melnicoff
CMC Public Relations
(650)324-8819
cmp1@earthlink.net
E-mail: cmp1@earthlink.net
Web site: http://www.vitesse.com
