SEZ Introduces New Generation Spin-Processor for 4-6 inch Wafer Fabrication
Source: SEZ Group
Villach, Austria. The SEZ Group announced the availability of its newest Spin-Processor for 4-6 inch chip fabrication. The Spin-Processor 102 adapts SEZ s proven state-of-the-art 200 and 300 mm equipment design for 4, 5 and 6 inch wafer diameters. The tool also meets SEMI s automation and communication (GEM implemented) standards.
"We are continually striving to meet or exceed the industry s needs and expectations for semiconductor wafer processing," explained Herwig Petschnig, chief operating officer of the SEZ Group. "The development of this newest offering meets the requirements of today s fabs with greater flexibility to accommodate the increasing variety of processes that the tool offers. The tool was designed to replace SEZ s Spin-Processor 101 because it enables thinner wafer handling and advanced 0.18 micron technology while offering enhanced reliability and software in a smaller footprint."
The main advantages of the Spin-Processor 102 in comparison to its predecessor are smaller footprint, compact design and faster handling which result in cost saving, faster installation and higher throughput. More flexibility is offered by the tool s availability of different handling systems, including Bernouilli handling for ultra-thin wafers. The SEZ 102 is a single-task, multi level wet processing machine with fully automatic cassette-to-cassette handling.
The system includes a Chemical Dispense System to provide up to three chemicals at the required quantity and temperature. Additional features of the Spin-Processor 102 are an integrated controller, integrated suck back box, flipmodule, uses through beam sensors and is GEM compatible, The tool requires no flat-alignment and offers frontside and backside processing with no equipment changes needed.
The main applications are backside film removal and cleaning, stress relief and wafer thinning of silicon, GaAs or other compound material wafers, wafer reclaim, post-etch polymer removal and oxide etching.
About SEZ
The SEZ Group is a leading supplier of spin-processing equipment to the global semiconductor manufacturing industry. The company s breakthrough proprietary Spin-Processor technology forms the basis of a broad portfolio of backside and frontside wafer surface conditioning products for semiconductor chipmakers worldwide. SEZ maintains development, manufacturing, sales, marketing and service operations in Europe, Asia and North America. Registered in Zurich, Switzerland, SEZ Holding AG is listed on the Swiss Exchange under the symbol (SWX: SEZN). SEZ also can be found on the World Wide Web at www.sez.com.
Contact:
Kurt Lackenbucher klackenbucher@sez.at Heinz Oyrer hoyrer@sez.at both of SEZ AG Tel: +43 4242 2040 Fax: +43 4242 20421 or Michael West of SEZ America Inc Tel: 602-437-5050 Fax: 602-437-4949 mwest@sez.com or Stew Chalmers of Positio Investor and Public Relations for SEZ America Inc. Tel: 650-815-1006 Fax: 650-815-1095 stew@positiopr.com
Kurt Lackenbucher
klackenbucher@sez.at
Heinz Oyrer
hoyrer@sez.at both of SEZ AG
Tel: +43 4242 2040
Fax: +43 4242 20421
or
Michael West of SEZ America Inc
Tel: 602-437-5050
Fax: 602-437-4949
mwest@sez.com
or
Stew Chalmers of Positio Investor and Public Relations for SEZ America Inc.
Tel: 650-815-1006
Fax: 650-815-1095
stew@positiopr.com
E-mail: stew@positiopr.com
Web site: http://www.sez.com
