Palomar Technologies Introduces the Microelectronic Packaging Engineer's Telecom Tool Kit
Source: Palomar Technologies
Vista, CA. Palomar Technologies announces the introduction of the Microelectronic Packaging Engineer s Telecom Tool Kit for designing and packaging products that operate at high frequencies. The Telecom Tool Kit assists with the challenges of increasing usable frequency by reducing the integrated circuit/package size, increasing the power driven through the circuit, and reducing insertion and return losses. The kit includes the latest tools for packaging high frequency products for the Telecom/Datacom market. They include: Automated Eutectic Die Attach, "Relative To" Die Placement, Ribbon Wire First Level Interconnect, Constant Wire Length Looping, Very Short Wire Length Looping, and High Frequency Ultrasonics.
Eutectic Die Attach transfers the tremendous amount of heat generated by high frequency circuits and draws it away from the active areas of the package. These systems can control the quality, accuracy, and the repeatability of placement. "Relative to die" places the die so that the second, third, and each die or substrate thereafter is placed relative to the final location of the last placed component rather than the package. This provides greater accuracy from component to component. The distance from die to capacitors can be made shorter, consistently reducing the length of the interconnect between the active and passive devices.
This flexible system reconfigures to replace round wire with ribbon wire which is used in high frequency circuits to reduce the parasitic inductance of the interconnect. Due to its rectangular shape, generating very low, repeatable loop profiles is easier than with conventional round wire bonding. The contact force of the wire is spread across a wider cross sectional area of the bonding pad, minimizing aggravation to underlying metallizations. Ribbon wire bonding reduces junction impedance, carries larger amounts of current due to the larger cross sectional area of the wire, and reduces insertion and return losses typically associated with high frequency round wire interconnects. Another factor of the tool kit, constant wire length, is critical because the length of the first level interconnect needs to be consistent, even if the distance between the bond points changes. The looping algorithms of Palomar s ribbon bonder automatically adjust for loop span changes. In addition, the system generates very short wires with very low profile loops. The Palomar Bonder accurately controls the bond tool in 3D space to assure that the exact amount of wire is spooled out during the loop formation. High Frequency Ultrasonics result in measurable performance improvements and/or increases in process capability of packaging. Low to ambient temperature bonding of gold wire and ultra fine-pitch applications require higher frequency ultrasonics to enable good bonding and reasonable yields.
According to Bradley K. Benton, Product Manager for Palomar Technologies, "With these six tools in the packaging engineer s toolbox, more repeatable, higher quality, higher yield products can be manufactured. These "tools" are critical to the success of any high volume manufacturing process and enable high frequency packaging at any volume."
Palomar Technologies provides complete process and equipment solutions for precision automated assembly of optical, RF and microelectronic packages in the photonic, wireless, microwave, automotive, aerospace and medical industries. Processes include high accuracy component assembly with eutectic solder or epoxy, with precision ball bonding, and wedge bonding for fine pitch devices. Equipment solutions range from islands of automation to complete integrated assembly lines of dispensers, placement stations, ovens, cleaners and wire bonders with automatic handling between process stations. Visit our web site at www.bonders.com or contact us at 760-931-3600. Palomar Technologies, "Enabling Lightwave Connectivity".
Contact: Palomar Technologies, Bruce Hueners 2230 Oak Ridge Way, Vista, CA 92083 Phone: (760) 931-3600 Fax: (760) 931-5191 sales@bonders.com
A·R Marketing, Inc., Andrea Roberts PO Box 501528, San Diego, CA 92150 Phone: (858) 451-8666 Fax: (858) 451-8777 aroberts@san.rr.com
Palomar Technologies, Bruce Hueners
2230 Oak Ridge Way, Vista, CA 92083
Phone: (760) 931-3600
Fax: (760) 931-5191
sales@bonders.com
A·R Marketing, Inc., Andrea Roberts
PO Box 501528, San Diego, CA 92150
Phone: (858) 451-8666
Fax: (858) 451-8777
aroberts@san.rr.com
E-mail: aroberts@san.rr.com
Web site: http://www.bonders.com
