+44 (0)24 7671 8970
More publications     •     Advertise with us     •     Contact us
 
News Article

Trikon Introduces High-Temperature Electrostatic Chuck For Optoelectronics Market

Source: Trikon

Newport, United Kingdom. Trikon Technologies, Inc. (Nasdaq: TRKN) a technology leader in semiconductor processing equipment, today announced availability of an advanced high-temperature electrostatic chuck for plasma etching compound semiconductors. This new electrostatic chuck is designed for the plasma etching of materials such as indium phosphide, used throughout the optoelectronics industry.

"Accurate temperature control during plasma etching of compound wafers is critical", said John Macneil, Vice President of Technology. "Most electrostatic chucks cannot effectively clamp compound semiconductor wafers for hot processes, leading to slower plasma etch processes and limited choices of etch chemistries. Up until now the only alternative was mechanical clamping, but this introduces particulates and causes wafer breakage, dramatically reducing yields and throughput. By adding reliable and uniform heating to our existing electrostatic chuck, field proven in production over many years, we have brought a production worthy solution to a major optoelectronics device manufacturing problem."

"Trikon specializes in low cost of ownership solutions for production", said Dr. Dave Thomas, Product Marketing Manager, Plasma Etch Products. "This new high temperature electrostatic chuck enables optimized etch chemistries leading to higher etch rates, cleaner processing, fewer process steps and higher tool utilization. As a result Trikon s Omega(R) high density plasma etch products offer a considerable reduction in the overall cost-of-ownership for optoelectronic device manufacturers."

Trikon s new technology products for compound and wireless semiconductor manufacture include: Sigma(R) fxP(TM) PVD. A metalization system offering high throughput and reliability with advanced process modules for lift off metalization, ultra high uniformity sputtering for acoustic wave devices and low temperature sputtered high k dielectrics.

Planar fxP(TM) Low K Flowfill(TM). An advanced low-k dielectric deposition system capable of both gap-fill and planarization enabling the low-k advantage of increased device speed to be brought to existing aluminum metalized devices.

Omega(R) M0RI(TM). An advanced high-density plasma etch chamber on a small footprint platform. The Omega(R) etcher can be configured with two chambers offering plasma etching and dedicated post etch processing. About Trikon Technologies:

Trikon Technologies, Inc. offers a broad range of semiconductor processing equipment for silicon, compound semiconductor device and optoelectronic production. Trikon has patents and patents pending on processes and equipment and continues to develop new low-k chemistries and processes for advanced applications. Trikon s website can be visited at: www.trikon.com

"Safe Harbor" Statement Under the Private Securities Litigation Act of 1995: This news release contains certain forward-looking statements. These forward-looking statements are subject to various risks and uncertainties that could cause results to differ materially, including, but not limited to, (1) that the semiconductor industry will experience conditions, such as changes in demand for various types of semiconductors, that will affect the demand for semiconductor production equipment and Trikon s products, (2) that Trikon will not adequately respond to technological developments impacting the semiconductor industry, (3) market acceptance of Trikon s products will not be forthcoming. These factors are not intended to represent a complete list of all risks and uncertainties inherent in the Company s business, and should be read in conjunction with the more detailed cautionary statements included in the company s SEC reports, including, without limitation, its annual report on Form 10-K, quarterly reports on Form 10-Q and current reports on Form 8-K.

Contact: Corporate: Trikon Technologies Inc. Carl Brancher TeL: +44 (0)1633 414111 carl.brancher@trikon.com or US Investor Relations: Golin/Harris Kelly Keisling Tel: 212 309 1436 kkeisling@golinharris.com or Press Relations: Trikon Technologies Inc. Karen Wright Tel: +44 (0)1633 474569 karen.wright@trikon.com or Plasma Etch technical: Trikon Technologies Inc. Dr. Dave Thomas Tel: +44 (0)1633 414027 dave.thomas@trikon.com

Corporate:
Trikon Technologies Inc.
Carl Brancher
TeL: +44 (0)1633 414111
carl.brancher@trikon.com
or
US Investor Relations:
Golin/Harris
Kelly Keisling
Tel: 212 309 1436
kkeisling@golinharris.com
or
Press Relations:
Trikon Technologies Inc.
Karen Wright
Tel: +44 (0)1633 474569
karen.wright@trikon.com
or
Plasma Etch technical:
Trikon Technologies Inc.
Dr. Dave Thomas
Tel: +44 (0)1633 414027
dave.thomas@trikon.com
E-mail: dave.thomas@trikon.com
Web site: http://www.trikon.com
×
Search the news archive

To close this popup you can press escape or click the close icon.
×
Logo
×
Register - Step 1

You may choose to subscribe to the Compound Semiconductor Magazine, the Compound Semiconductor Newsletter, or both. You may also request additional information if required, before submitting your application.


Please subscribe me to:

 

You chose the industry type of "Other"

Please enter the industry that you work in:
Please enter the industry that you work in: