Endwave Awarded Key Ultra-Broadband Wireless Technology Patents

Source: Endwave Corporation

Three Patents Essential to Revolutionary Flip Chip Integrated Circuit Technology

Sunnyvale, CA. Endwave Corporation (Nasdaq:ENWV), a leading provider of radio frequency (RF) subsystems for wireless Ultra-broadband access networks, today announced that the United States Patent Office has awarded the company three new patents covering key aspects of its Flip Chip Integrated Circuit (FCIC) technology, the core technology that powers Endwave s ultra-broadband wireless systems. The three new issues bring to 32 the total number of patents held by Endwave, 23 of which are on Endwave s FCIC technology, more than any other company in the industry.

Endwave s FCIC technology offers significant cost reductions on expensive semiconductor materials, such as Gallium Arsenide (GaAs), Indium Phosphide (InP), Gallium Nitride (GaN) and like materials. FCIC designs minimize the use of passive components such as resistors, capacitors, inductors, couplers, filters and vias on the chips. In addition, FCIC chips are frequency-independent, allowing the same part to be utilized across a variety of frequency bands. This feature provides significant inventory and cost reduction advantages and improves time-to-market due to the simplification of parts inventory. The new FCIC patents issued include the following:

1. Patent 6,094,114 -- Slotline-to-Slotline Mounted Flip Chip. Millimeterwave circuit technology that eliminates the need for costly ground connections through the substrate and enables more robust, reliable and lower-cost circuits than is possible with alternative chip-and-wire technology.

2. Patent 6,034,580 -- Coplanar Band Pass Filter. A coplanar band pass filter that requires no connection to the backside of a circuit, making it compatible with Endwave s vialess FCIC process. This filter eliminates unwanted signals and, because it does not require tuning, reduces manufacturing/testing time.

3. Patent 6,064,253 -- Self-Biasing RF Transistor Circuit. A low-cost multi-stage RF amplifier bias circuit for FCICs. This patent covers a method of connecting coplanar waveguide circuits so that negative bias is not necessary. This circuit improves system performance by eliminating the use of source bypass capacitors and their parasitics that degrade performance.

"By assembling one of the finest teams of millimeterwave technologists in the country, we have been able to build a patent portfolio on FCIC technology that is unmatched in the industry," said Cliff Mohwinkel, Ph.D., vice president and CTO of Endwave. "These inventions provide Endwave and its customers a unique path to low-cost, high-volume manufacturing of ultra-broadband wireless radios. FCIC technology enables us to reduce the size of the GaAs chips -- the most expensive component of millimeterwave radios -- by a factor of 5 to 10."

About Endwave

Endwave Corporation (Nasdaq:ENWV) provides radio frequency (RF) subsystems for wireless ultra-broadband access networks. The company develops and manufactures products used in high-speed cellular backhaul, point-to-point access and point-to-multipoint access applications. These products include RF modules, integrated transceivers, ultra-band antennas and high-performance OutDoor Units (ODUs). Endwave has more than 30 issued patents covering its core technologies including semiconductor, circuit and antenna designs as well as its Flip-Chip GaAs MCIC technology. Endwave Corporation is headquartered in Sunnyvale, California (http://www.endwave.com).

"Safe Harbor" Statement under the Private Securities Litigation Reform Act of 1995: Statements in this press release may contain forward-looking statements within the meaning of the Federal securities laws and are subject to the safe harbors created thereby. The following are among the factors that could cause actual results to differ materially from the forward-looking statements: the risks that products will fail to achieve market acceptance, the timing of customer orders, delays in the design process, the length of our sales cycle, our ability to develop, introduce and market new products and product enhancements, changes in product mix or distribution channels; the demand for wireless networking products and end-user products that incorporate wireless technology; competitive technologies; and, technological difficulties and resource constraints encountered in developing and/or introducing new products. Forward-looking statements contained in this press release should be considered in light of these factors and those factors discussed from time to time in the company s public reports filed with the Securities and Exchange Commission, such as those discussed under "Risk Factors" in the Company s report on form S-1, which was declared effective on October 16, 2000, and form 10-Q, filed November 30, 2000.

Contact: Endwave Corporation, Sunnyvale Gary Gray Tel: 408/522-3100 gary.gray@endwave.com or Walt & Company Communications Reena Spektor Tel: 408/496-0900 rspektor@walt.com