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News Article

Suss Receives Multiple Orders for New Metal Lift-Off System

Source: Karl Suss

Munich, Germany. Karl Suss (Frankfurt: SMH) has received multiple orders for its recently introduced M6000L Metal Lift-off Cluster system from a large North American gallium arsenide (GaAs) wafer fab. The tool addresses challenging process areas in the manufacture of high frequency devices, for example, metal lift-off can be used to create three-dimensional metal interconnects surrounded by air and enables the deposition, or patterning, of materials such as gold, tantalum and titanium. Delivery is expected in the first quarter of 2001.

"Interest in the M6000L Metal Lift-off Cluster has been very strong since its introduction due to the process advantages it offers for high frequency devices based on GaAs, lithium niobate, indium phosphide and similar materials," explained James Hermanowski, international product manager for Suss. "We have sampled many customers in the GaAs, optoelectronic and telecom markets and proven the capabilities of the M6000L as a solution for a wide range of products requiring metal lift-off."

The M6000L Metal Lift-off Cluster incorporates an innovative design utilizing automated single wafer process sequencing that provides superior performance and reliability over existing batch or mixed batch and single wafer systems. The M6000L prevents waste metal redeposition, or bridging, by peeling away the unwanted metal while leaving behind metal traces on the wafer where desired. Traditional batch processes cannot offer the required selectivity to avoid bridging.

The tool offers a compact footprint, low chemical consumption and potential for high process material utilization, which reduces cost of ownership for metal lift-off processes. The M6000L system complements Suss existing exposure tools, coat/develop clusters, flip chip bonders and high frequency prober solutions to provide a more complete end to end package for customers engaged in creating the next generation of communication chips.

About Karl Suss

Karl Suss is a global supplier of manufacturing equipment and process technology for the advanced packaging, microelectronics and MEMS markets. With over 7,000 systems installed, Suss products include coating and developing systems, proximity lithography systems, substrate bonders, flip chip bonders and probe systems. Headquartered in Munich, Germany, Suss operates nine manufacturing, sales and service centers in North America, Europe, Asia and Japan. More information about Karl Suss and its products is available from its web site at www.suss.com or www.suss.de. News release issued on behalf of Suss MicroTec AG (Frankfurt: SMH), holding company of Karl Suss.

Contact: James Hermanowski of Karl Suss America Tel: 802-244-5181 Fax: 802-244-5103 jhermano@suss.com or Amy Smith of Positio Investor & Public Relations Tel: 401-272-1681 Fax: 401-272-4281 amy@positiopr.com, for Karl Suss

 

James Hermanowski of Karl Suss America
Tel: 802-244-5181
Fax: 802-244-5103
jhermano@suss.com
or Amy Smith of Positio Investor & Public Relations
Tel: 401-272-1681
Fax: 401-272-4281
amy@positiopr.com, for Karl Suss
 
E-mail: amy@positiopr.com
Web site: http://www.suss.com
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