Vitesse 1.0 um InP Process Technology Enables OC-768 Performance

Bosch gets $225m CHIPs funding for US SiC fab

More CHIPS funding for GlobalWafers

VueReal to show microLED design kits at CES

Cree LED and Daktronics sign LED agreement

Fraunhofer IAF to expand III-V chiplet capabilities

Quantum Science claims QD leadership

Vertical GaN diode offers superior surge current capability

X-FAB launches next-generation SiC platform

VueReal to show microLED tech at CES

CSA Catapult publishes annual report

Soitec continues collaboration with MIT

Aixtron opens innovation centre

Astute and Wise sign distribution deal

Belgian group unveils pb-free QD-based SWIR sensor

EU Chips Act pilot line starts operation

Scientists make QD lasers for SWIR applications

Vishay sensor wins two innovation awards

Ayar Labs secures $155m to scale optical interconnects

VisIC and AVL forge EV GaN partnership

$3M Penn State grant for power GaN research

Infineon wins German sustainability award 2025

New funding for Scotland’s photonics sector

Coherent and X-Fab to receive CHIPS Act funding

Rohm and TSMC launch EV GaN partnership

Onsemi to acquire Qorvo SiC JFET business

ULVAC and SAL join forces on TFLN

EPC launches solar optimiser reference design

Riber celebrates 60 years of success

Promoting the PCSEL

Semiconductor lasers are driving innovation

EU project to develop high voltage DC WBG tech

Imec integrates InP chiplets on RF Si interposer