SUSS MicroTec Repositions for Global Success Company to Replace Karl Suss Name and Logo
Munich, Germany. SUSS MicroTec announced that the Karl Suss Group will operate worldwide under the name SUSS MicroTec, adopting the name of its German holding company. The change was made to reinforce the company s position as a global supplier of manufacturing equipment for large-scale production. SUSS MicroTec s technology is already well positioned in multiple growing markets, including advanced packaging, compound semiconductors, microsystem technology, telecommunications and test and measurement.
The new name and logo symbolize a turning point in the history of the company, explained Franz Richter, president and CEO of SUSS MicroTec. In the past few years, SUSS MicroTec has changed from a simple equipment manufacturer for universities and R&D applications to a complete solution provider for large scale production. This tremendous change in direction warranted updating the company s image to demonstrate how strongly we have embraced this new role.
In 2000, the company achieved its best results ever with an above-average sales increase of more than 85 percent and a sales volume of 162 Million Euro. Despite the current downturn in the semiconductor industry, SUSS MicroTec increased its turnover in the first six months of 2001 by about 81.4 percent compared to the same period in 2000.
The company has been listed on the Neuer Markt of the Frankfurter Stock exchange under the SUSS MicroTec name since May 18, 1999. With over 7,000 systems installed, SUSS MicroTec products include coating and developing systems, proximity lithography systems, substrate bonders, flip chip bonders and probe systems.
Among the proximity mask aligners, the MA200 has emerged as the solution for advanced packaging volume production. Mask aligners are full field exposure systems that can expose a 200 mm wafer in one step, resulting in a high throughput that is especially important for wafer level chip scale packages. Compared to steppers, mask aligners are more reliable, flexible and have a lower cost of ownership. In 2000, SUSS MicroTec sales of the MA200 mask aligners and microlithography clusters for the advanced packaging market increased by 100 percent.
SUSS MicroTec s newest product offering is a 300 mm lithography cluster, which consists of an MA300 mask aligner module linked to an ACS300 spin-coating system. The tool, called the LithoPack300 (LP300), is specifically designed for wafer bumping and wafer level packaging applications on 300 mm wafers.
Our innovative technology solutions and depth of knowledge across a variety of disciplines have positioned SUSS MicroTec extremely well to support the demands of the dynamic semiconductor industry well into the future, said Richter. ``We are confident that the new name will stand for advanced technology, quality and innovation in the coming years.
In 1949 the company started with three workers in a bombed out apartment as a representative of the optics company Ernst Leitz. The first semiconductor manufacturing equipment was designed fifteen years later in a garage in Munich, Germany. Today the company employs about 1,000 people worldwide. The group has 10 sites in North America, Europe and Asia and over 30 sales and service offices worldwide.
About SUSS MicroTec SUSS MicroTec is a global supplier of manufacturing equipment and process technology for the advanced packaging, microelectronics and MEMS markets. With over 7,000 systems installed, SUSS MicroTec products include coating and developing systems, proximity lithography systems, substrate bonders, flip chip bonders and probe systems. Headquartered in Munich, Germany, SUSS MicroTec operates manufacturing, sales and service centers in North America, Europe, Asia and Japan. More information about SUSS MicroTec and its products is available from its web site at http://www.suss.com. Contact: Wolfgang F. Bindl SUSS MicroTec AG Fon:+49 89 32007-311 Fax:+49 89 32007-336 or W.Bindl@suss.de Gaël Schmidt Karl Suss France Phone:+33-450353823 Fax : +33-4503599 00 gschmidt@karl-suss-technique.fr or Agency: Amy Smith Positio Investor & Public Relations Phone: (401) 272-1681 Fax: (401) 272-4281 E-mail: amy@positiopr.com
Wolfgang F. BindlSUSS MicroTec AG
Fon:+49 89 32007-311
Fax:+49 89 32007-336
or
W.Bindl@suss.de
Gaël Schmidt
Karl Suss France
Phone:+33-450353823
Fax : +33-4503599 00
gschmidt@karl-suss-technique.fr
or
Agency:
Amy Smith
Positio Investor & Public Relations
Phone: (401) 272-1681
Fax: (401) 272-4281
E-mail: amy@positiopr.com
E-mail: amy@positiopr.com
Web site: http://www.suss.com
