Xindium Technologies unveils plans for InP chipsets
"Xindium s products target the demand for high performance/high bit-rate devices that are driving integration onto a common chipset," said Cindana Turkatte, president and CEO of Xindium. "Our expertise in the application and manufacture of high frequency InP devices gives us a powerful advantage. Early indications from customers have shown that we are on the right path with our technology, product development and customer-driven approach."
Xindium s initial product offering will be customer-selectable TIA and integrated pin/TIA chips including chip-on-carrier devices for transceiver and transponder module makers. In addition, Xindium will produce a chip-on-carrier with a patent pending RF connector for more traditional transport module customers.
Xindium leverages much of its core technology from the advanced research conducted by the company s founders at UIUC over the past two decades. The management team is headed by Ms. Turkatte, who brings 15 years of management experience in the optical and communications networking industries. She joined Xindium from tunable laser-maker iolon, Inc., where she was VP of marketing. Members of the management team include; Jose Schutt-Aine, a founder and vice president; Milton Feng, a founder and vice president and Ilesanmi Adesida, a founder and consultant.
Incorporated in March 2001 with venture backing from Vantage Point Venture Partners and encouragement from the University of Illinois at Urbana-Champaign (UIUC), Xindium Technologies, Inc. is a privately held company focused on next-generation products for high frequency/high bit-rate semiconductor digital and optical component devices for optical and wireless network applications. Xindium leverages expertise in the design and production of high frequency devices for 10 Gbit/s and 40 Gbit/s optical networks.
Kendra Gross
Porchivina and Associates
Tel. +1 415 893-9138
Fax: +1 415 893-8185
E-mail: kendra@papr.com
Web site: http://www.xindium.com
