Technical Insight
Infineon launches a Tri-band PA module (New Devices)
Munich, Germany. Infineon has designed a new PA module for mobile phones used in 900, 1800 and 1900 MHz bands, enabling users to roam between GSM, PCN and PCS networks. The CGM20GTriB is based on the company s GaAs MESFET process and employs a low-temperature co-fired ceramic (LTCC) substrate. The maximum output power of 34.5 dBm for GSM and 32.0 dBm for PCN/PCS (supply voltage of 3.2 V) is achieved for an input power of only 3 dBm. The CGM20GTriB is based on the CGM20G, a dual-band GSM/PCN PA module that supports data rates of 57.6 kbit/s in the uplink four times greater than standard GSM phones. The CGM20GTriB is sampling now and will be available in high volume by the middle of 2001. www.infineon.com