Technical Insight
Mitsubishi shrinks MMIC PA packages (New Devices)
Sunnyvale, CA. Mitsubishi Electric has rolled out two new MMIC PAs based on its GaAs HBT process. The company s new BA01202 chipset boasts increased performance, a 25% reduction in idle current and 35% reduction in overall size, and is designed for the 1.9 GHz CDMA band. This device is complemented by the BA01203, engineered for the 800 MHz CDMA band. The two amplifiers feature a single positive 3.2 V supply, 25 dB of gain and 50 ohm matching from a 6 6 mm module package. Sampling now as a combined 800/1900 MHz chipset, the company s BA01202 and BA01203 devices are currently in volume production for $6 per 10 000 units (see ). www.mitsubishichips.com
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