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Filtronic launches 'game changing' E-band module

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New E-band transceiver combines Morpheus II transceiver with SSPA module

In response to the growing demand for enhanced backhaul network performance, designer and manufacturer of RF-to-mmWave technology, Filtronic, has announced the launch of the Hercules II high-power E-band transceiver module.

The new transceiver module combines Filtronic’s Morpheus II transceiver with the powerful Cerus 4 or Cerus 8 SSPA module, delivering unmatched performance and setting a new standard in the industry, which the company describes as 'game-changing'.

The Morpheus II module forms the system's core, streamlining RF communication within the E-band. This sub-system ensures seamless integration with high-speed modems, enabling efficient full-duplex data exchange, according Filtronic. The Cerus amplifier boosts transmit power. This translates to a longer operational range and superior signal strength.

The Hercules II can support advanced modulation techniques and includes a low noise LNA. This makes it suitable for latency-sensitive private networks where speed and extended link length are of the essence, including low latency private networks and applications such as HAPS and UAVs.

Key features of the Hercules II include fully integrated 71-76 to 81-86 GHz TRx modules, supporting Tx output power in excess of 35dBm, and low phase noise at -112dBc/Hz at 1MHz. The module also supports up to 512QAM modulation and greater than 2GHz channel bandwidth. The integrated diplexer and single T/R port for antenna interface facilitate a simple modem connection, ensuring 100 percent calibration and testing for optimal performance.

“In developing the Hercules II, we focussed on delivering a solution that not only meets, but exceeds the performance demands of modern high-speed networks,” said Walter Magiera, CCO at Filtronic. “This transceiver module is designed to provide exceptional reliability and efficiency, ensuring our customers can maintain optimal network performance even under the most challenging conditions. Its advanced features and robust design make it a versatile tool for a wide range of cutting-edge applications.”

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