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Sivers Semis receives CHIPS Act funding

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$6M award accelerates lab-to-fab development of beamformer IC and array designs
Sivers Semiconductors has received first-year funding of $6 million from the Northeast Microelectronics Coalition (NEMC) Hub through the US CHIPS and Science Act.

The award funds collaboration between Sivers Semiconductors and partners Ericsson, Raytheon, MIT, Boston University, and Northeastern University, focusing on 5G/6G beamformer IC and array designs for FR3 frequencies (7-15 GHz) to enhance future 5G and 6G networks.

Applications include enhanced mobile communication, support for IoT devices, and advancements in autonomous vehicle technologies.

Sivers Semiconductors will lead the program, which is one of six projects awarded to the NEMC Hub, led by Massachusetts Technology Collaborative (MassTech), under the Microelectronics Commons Program. The funding is potentially renewable across three years.

FR3 frequencies (7-15GHz) are the next frontier for 5G-Advanced and 6G network deployments, combining the best features of sub-6GHz and millimetre-wave bands. They enable significantly wider bandwidths than sub-6GHz frequencies, and exhibit superior propagation characteristics than millimetre-waves, particularly in dense urban environments. This will enable carriers to deploy FR3 infrastructure on existing cell sites without needing to densify the network.

"This initiative propels Sivers into the forefront of 5G/6G innovation," said Vickram Vathulya, CEO of Sivers Semiconductors. "Our collaboration with partners such as Ericsson and Raytheon will allow us to develop relevant innovative technology and products with dual-use applications across commercial and defence sectors.”

"We are excited to be part of the first tranche of the Microelectronic Commons projects," said Mathias Riback, head of Ericsson Advanced Technology & Industry US "By leveraging our expertise in telecommunications and semiconductor technology, we aim to be leading the development of 6G infrastructure. This project also reinforces our commitment to bolstering the US technology ecosystem."
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