Photon Bridge unveils tuneable laser PIC
Eindhoven-based Photon Bridge has announced the debut of its integrated tuneable laser photonic integrated circuit (PIC), powered by the company’s novel cantilever waveguide coupling technology.
The device is the first commercial demonstration of Photon Bridge’s integration platform and will be used by OE Solutions as the laser engine inside its next-generation integrated tuneable laser assembly (ITLA) modules.
Unlike conventional approaches, Photon Bridge’s platform enables seamless combination of the optimal materials for each function—without restrictions on material choices—through a scalable, OSAT-compatible integration process.
This flexibility allows the laser PIC to pair III-V gain and detection with low-loss silicon passive elements, all within a cost-efficient model ready for high-volume manufacturing.
The tuneable laser PIC integrates gain, SOA, filter, and wavemeter functions into a compact single device. Samples already demonstrate linewidths below 100 kHz and full C-band tuning range, with product designs targeting a footprint of 15mm2, delivering a fully integrated, highly cost-effective solution for customers.
Beyond ITLAs, the same integration platform is designed to scale toward compact, fully integrated coherent subsystems, enabling a new class of miniaturised optical engines for both telecom and AI infrastructure.
Built on a silicon foundation, the platform also provides a direct path to integrating coherent and coherent-lite long-range scale-across links into data centre switches in a footprint compatible with co-packaged optics (CPO). This opens the door to next-generation switch architectures where advanced optical engines are natively embedded, maximising bandwidth density while minimising power and cost.
“AI data centres are racing to scale-across massive GPU clusters, creating exploding demand for compact, energy-efficient tuneable lasers,” said Paul Marchal, CEO of Photon Bridge. “Our silicon-based integration platform is built for this moment—delivering the performance customers need today in ITLAs, while extending naturally to DWDM architectures, co-packaged optics (CPO) and fully integrated coherent links in next generation data centre switches. Partnering with OE Solutions to bring this technology to market underscores both the strength of our platform and the credibility of our execution.”
OE Solutions is already integrating the new PIC into its ITLA. “Photon Bridge’s integration technology is a genuine breakthrough,” said Y.K. Park, CEO at OE Solutions. “The ability to combine the best materials without compromise—and to do so with a scaleable, cost-efficient process—enables compact, high-performance ITLAs and next-generation coherent modules. We’re excited to be the first to bring this platform into commercial products.”
Qualification is ongoing, with broader PIC sampling to additional customers anticipated in Q4 2025. Module sampling from OE Solutions is anticipated in Q2 2026.
