CoolSem establishes expert advisory board
CoolSem Technologies, an Eindhoven-based firm developing wafer-level, semiconductor thermal management technology, has appointed a high-profile advisory board.
As semiconductor devices face rapidly increasing power densities, thermal management has become a defining bottleneck for system performance and reliability. To address this challenge at scale, CoolSem Technologies has assembled a board combining expertise in semiconductor processing, materials science, global operations, strategy, and finance.
Satu Lipponen, former executive director at Murata Manufacturing and Nokia and now an independent board professional, brings more than three decades of international leadership experience in technology-driven organisations. Reflecting on her role, she emphasises the importance of translating breakthrough innovation into global value creation, delivering customer promises and scalable business impact with the power of the team.
Fred Roozeboom, a leading authority in thin-film technology and atomic layer processing, strengthens the board’s deep-technology foundation. With a career spanning Philips Research, NXP Semiconductors, TNO Holst Centre, and the Universities of Eindhoven and of Twente, he contributes extensive expertise in nano-sized materials engineering and semiconductor process innovation. He underscores the urgency of addressing the rising heat dissipation challenges associated with AI, big data storage, and optical communication: challenges that demand fundamentally new material and thermal management concepts.
Koen Bouwers, an experienced international executive and supervisory board member, adds strategic and financial depth. Having worked with global corporations including Philips and Apple, as well as scaling technology-driven companies through pivotal growth phases, he supports CoolSem Technologies in defining strategic direction and financial planning during critical early-stage decisions.
With its WaLTIS multilayer stack, CoolSem Technologies replaces conventional substrates with an engineered stack designed to enhance heat flow, mechanical stability, and reliability, enabling higher performance and longer lifetime for next-generation devices.
