News Article

Innovative Thin Wafer Handling For CS Device Processing

Brewer Science is introducing a thermal debonder, an enhanced ZoneBOND separation tool and a cleaning system for III-V compound materials such as gallium arsenide and nitride, indium phosphide and silicon carbide

Brewer Science has unveiled new processing equipment specifically designed for thin wafer separation and post-debonding cleaning of compound semiconductor materials.

These steps are critical for ultrasensitive compound semiconductor (CS) device processing.

Brewer says these latest tools enable thin wafer handling technologies and broaden the process window and lower total cost of ownership by reducing yield loss and increasing throughput.

“Brewer Science Cee lab-scale processing equipment offers track-quality precision and is suitable for low-volume prototype processing that enables transfer to high-volume manufacturing," says Wayne Farrar, Director of Equipment.

“No other company is as uniquely positioned as Brewer Science to offer complete solutions for your thin wafer handling needs. With our temporary bonding materials and lab-scale equipment, we bring a breadth and depth of process experience that is unequalled by any other company," boasts Farrar.

There are three new semi-automatic thin wafer handling tools manufactured by Brewer Science for CS processing applications.

The first is the Cee 1300CSX thermal debonder, which enables high-temperature slide-off debonding of thinned III-V and CS materials including GaAs, GaN, InP, and SiC, in a confidential laboratory setting.

Semiautomatic Benchtop Debonder ; Cee 1300CSX

The ZoneBOND separation tool has been enhanced with compliant seal clamps and fail-safe abort hardware to accommodate thinned III-V and CS materials. Brewer says the its latest product provides superior precision control for debonding materials that are highly sensitive to mechanical and thermal shock, flexibility for sizes ranging from 2 inches to 300 mm, and very-low-stress room temperature debonding.

ZoneBOND Separation Tool

The final product is the Cee 300MXD megasonic cleaning system, which applies uniform acoustic energy to spinning substrates to gently remove adhesive residues and contaminants without damaging fragile device structures.

Megasonic Developer/Cleaner; Cee 300MXD
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