News Article
Albeo advances LED fixture technology
The firm has been granted four patents related to "Chip-in-Fixture" technology which promises to lower LED fixture costs to below that of fluorescent lighting. This is hoped to pave the way to making LED the dominant lighting choice
With the recent granting of four new patents, Albeo Technologies is advancing its strategy of LED fixture innovation.
The new patents protect fundamental innovations in LED chip integration, fixture construction and electronic architecture that significantly reduce costs and improve efficiency.
The company's most recent patent is for a "chip-in-fixture" (CIF) LED lighting platform. This innovation covers the integration of unpackaged LED chips directly on the inside surface of the external shell of the fixture, to substantially reduce the raw material cost of LED fixtures and dramatically improve performance.
The CIF design minimises thermal resistance by eliminating printed circuit boards, heat sinks, and the actual LED package. With this foundational patent, Albeo has developed working prototypes for next generation commercial and industrial LED fixtures. The company expects to begin marketing these fixtures in 2013.
"The chip-in-fixture patent is a fundamental change in the state-of-the-art at the fixture level," says Albeo Technologies Co-Founder and CEO Jeff Bisberg. "By removing many of the materials and layers currently used in LED fixtures, we are able to both reduce costs and improve efficiency. In the very near future, we anticipate this type of fixture design will allow LED fixtures to surpass fluorescent lighting in value, performance and even upfront cost."
A second patent granted details a method of interconnecting light-emitting diodes and phosphors between two layers, such as glass or plastic, to build unique, flat, white light-emitting structures. The patent protects a new way to combine LEDs and phosphor that are extremely thin and provide very high performance.
The third details a unique method of dissipating heat generated by LEDs by configuring a printed circuit board with conductors on the front side, so that heat is dissipated from the LED to the conductors. This faster heat dissipation cools the LED fixture more rapidly, to maintain a higher efficiency at lower costs.
The final patent is related to a method for communication between LED fixture cases and AC powered LED modules to control the on/off and dimming with Pulse Width Modulation (PWM), without the need of a ground to reference to the control signal.
The new patents protect fundamental innovations in LED chip integration, fixture construction and electronic architecture that significantly reduce costs and improve efficiency.
The company's most recent patent is for a "chip-in-fixture" (CIF) LED lighting platform. This innovation covers the integration of unpackaged LED chips directly on the inside surface of the external shell of the fixture, to substantially reduce the raw material cost of LED fixtures and dramatically improve performance.
The CIF design minimises thermal resistance by eliminating printed circuit boards, heat sinks, and the actual LED package. With this foundational patent, Albeo has developed working prototypes for next generation commercial and industrial LED fixtures. The company expects to begin marketing these fixtures in 2013.
"The chip-in-fixture patent is a fundamental change in the state-of-the-art at the fixture level," says Albeo Technologies Co-Founder and CEO Jeff Bisberg. "By removing many of the materials and layers currently used in LED fixtures, we are able to both reduce costs and improve efficiency. In the very near future, we anticipate this type of fixture design will allow LED fixtures to surpass fluorescent lighting in value, performance and even upfront cost."
A second patent granted details a method of interconnecting light-emitting diodes and phosphors between two layers, such as glass or plastic, to build unique, flat, white light-emitting structures. The patent protects a new way to combine LEDs and phosphor that are extremely thin and provide very high performance.
The third details a unique method of dissipating heat generated by LEDs by configuring a printed circuit board with conductors on the front side, so that heat is dissipated from the LED to the conductors. This faster heat dissipation cools the LED fixture more rapidly, to maintain a higher efficiency at lower costs.
The final patent is related to a method for communication between LED fixture cases and AC powered LED modules to control the on/off and dimming with Pulse Width Modulation (PWM), without the need of a ground to reference to the control signal.
