News Article
OneChip takes on Jonathan Boocock to develop InP PICs
Boocock will lead the company's efforts to extend its indium phosphide PIC technology into the next-generation data centre interconnect market
OneChip Photonics has named Jonathan Boocock its Vice President of Product Development.
Jonathan Boocock, VP of Product Development
Boocock is responsible for the development of OneChip’s Photonic Integrated Circuit (PIC)-based Passive Optical Network (PON) transceivers and Bi-directional Optical Sub-Assemblies (BOSAs).
He will lead the company’s efforts to extend this breakthrough technology into the next-generation data centre interconnect (NG DCI) market.
“Jonathan knows what it takes to succeed in the very cost-sensitive, high-volume broadband access arena,” says Jim Hjartarson, CEO of OneChip Photonics. “His experience in developing innovative optical communications solutions, from the ground up, will be crucial as we look to extend our unique PIC technology to the fast-growing data communications market.”
Boocock, 49, has more than 25 years of industry experience and most recently was Executive Vice President of Engineering at BTI Systems Inc., where he managed development of the BTI 7000 Series Service Edge and Aggregation Packet Optical Platform from its inception to its volume delivery to carriers worldwide.
Previously, he was a co-founder and member of the senior management team at Catena Networks, an Ottawa-based broadband access start-up, which was sold in May 2004 for U.S. $487 million to Ciena Corporation. Boocock was also a senior manager at Nortel Networks, where he led development of its World Line Card access product, which shipped in volumes of more than 12 million lines per year and has a deployed base of greater than 200 million lines.
“I am excited to join a company that was the first to develop fully integrated optical modules for the PON market,” Boocock says. “I look forward to leading our product development efforts in this and the exploding data communications market, where our technology can greatly reduce the cost and footprint of optical modules and boost optical interconnect speeds to 40G, 100G and beyond.”
OneChip, on May 21st, 2012, announced that it will make available, in the second half of this year, engineering samples of its PIC-based 40GBASE-LR4 and 100GBASE-LR4 receiver chips for partner testing. The company also expects to make engineering samples of its 40GBASE-LR4 transmitter optical components and 100GBASE-LR4 single-chip transmitter PICs available, after the release of its PIC-based receiver chips.
According to Boocock, OneChip will use the feedback that it receives from these initial 40G and 100G engineering sample designs to develop PIC-based optical modules – such as Transmitter Optical Sub-Assemblies (TOSAs) and Receiver Optical Sub-Assemblies (ROSAs) – which can be used to lower costs, boost performance and improve reliability in high-speed optical interconnect applications. These solutions would help remove traffic bottlenecks in data centers and in campus and enterprise networks.
Meanwhile, the company will continue to grow the Engineering team that is focused on this effort.
“We have an opportunity, with our PIC technology, to make a significant impact in the PON market and the Next-Generation Data Centre Interconnect market, and we want to bring in additional Engineering talent to supplement the strong team that we have in place,” Boocock adds.
