News Article
Microsemi launches SiGe power amplifier for Wi-fi applications
A new silicon germanium device is the second in a series of devices aimed at accelerating the propagation of the next-generation Wi-Fi standard
Microsemi Corporation has introduced a 5 gigahertz (GHz) LX5509 power amplifier (PA) for IEEE 802.11ac, also known as fifth generation Wi-Fi, wireless access points and media devices.
The firm says its LX5509 is the first commercially available PA that can transmit at similar power levels in both IEEE 802.11n and IEEE 802.11ac networks. This allows optimum system performance by extending the high data rate range.
"Our new PA is the second in a series of devices we are introducing to accelerate the proliferation of the next-generation Wi-Fi standard," says Amir Asvadi, vice president and general manager of Microsemi's Analogue and Mixed Signal group. "We will continue to focus on strengthening our 802.11ac portfolio with industry-leading solutions and partnering with world-class WLAN manufacturers to deliver circuits that provide the highest system performance."
Apart from its power capabilities, the LX5509 features a standardised pin out. This enables customers to, without layout changes, later upgrade the performance level in their systems with higher power 5 GHz PAs that are currently in development at Microsemi.
Microsemi's 802.11ac solution offerings include the LX5586, what the firm says is the world's first monolithic SiGe RF front-end device. The company recently announced that this innovative solution works in conjunction with Broadcom's BCM4335 combo chip for mobile platforms.
The LX5509 is packaged in a 4 mm x 4 mm quad flat no-lead package and is available now for sampling.
The firm says its LX5509 is the first commercially available PA that can transmit at similar power levels in both IEEE 802.11n and IEEE 802.11ac networks. This allows optimum system performance by extending the high data rate range.
"Our new PA is the second in a series of devices we are introducing to accelerate the proliferation of the next-generation Wi-Fi standard," says Amir Asvadi, vice president and general manager of Microsemi's Analogue and Mixed Signal group. "We will continue to focus on strengthening our 802.11ac portfolio with industry-leading solutions and partnering with world-class WLAN manufacturers to deliver circuits that provide the highest system performance."
Apart from its power capabilities, the LX5509 features a standardised pin out. This enables customers to, without layout changes, later upgrade the performance level in their systems with higher power 5 GHz PAs that are currently in development at Microsemi.
Microsemi's 802.11ac solution offerings include the LX5586, what the firm says is the world's first monolithic SiGe RF front-end device. The company recently announced that this innovative solution works in conjunction with Broadcom's BCM4335 combo chip for mobile platforms.
The LX5509 is packaged in a 4 mm x 4 mm quad flat no-lead package and is available now for sampling.
