Monday 1st October 2001
Monday 1st October 2001
Monday 1st October 2001
Monday 1st October 2001
Henry Hendriks, Bharat Patel, Jim Crites and John Moore explore the challenges of back-side processing and the developments under way to turn wafer thinning, via hole etching and back-metal deposition into high-yield and high-throughput processes.
Monday 1st October 2001
Monday 1st October 2001
Monday 1st October 2001
Monday 1st October 2001
Monday 1st October 2001
Monday 1st October 2001
Monday 1st October 2001
Monday 1st October 2001
Monday 1st October 2001
Monday 1st October 2001
Monday 1st October 2001
Monday 1st October 2001
Monday 1st October 2001
The technique of rapid thermal processing in compound semiconductor manufacturing provides extremely low thermal budgets and excellent temperature and ambient control capability. Hin Yiu Anthony Chung and Martin Drechsler of Mattson Thermal Products explain.
Monday 1st October 2001
Motorola, in collaboration with IQE, has demonstrated the growth of gallium arsenide on large-area silicon substrates. This could open the way to low-cost GaAs device manufacturing and a multitude of integration possibilities, writes Marie Meyer.
Monday 1st October 2001
Monday 1st October 2001
Monday 1st October 2001
Monday 1st October 2001
Monday 1st October 2001
Monday 1st October 2001
