Marktech extends photodiode and LED capabilities
Marktech has announced a new transfer-moulded packaging platform expands both complete-off-the-shelf (COTS) and custom optoelectronic options for demanding defence and aerospace sensing, targeting, and optical alignment systems.
Transfer moulding enables compact SMT packages with integrated optical control, improved mechanical robustness, tighter alignment tolerances, and reduced stray light—important benefits for precision emitters and detectors used in rugged environments. Marktech already lists transfer-moulded point-source emitters such as VS679SMTR2, VS679SMTR1, and LS852SMTR1 as COTS examples in its point-source emitter family.
Marktech says it new packaging technology provides important advantages for military and aerospace optical systems where shock resistance, alignment stability, and long-term reliability are critical.
Unlike conventional open wire-bond structures, the transfer-moulded resin mechanically encapsulates and locks the wire bonds in place, significantly improving resistance to vibration, mechanical shock, thermal cycling, and harsh environmental exposure encountered in aircraft, missiles, drones, armoured vehicles, and space-constrained defence electronics. The moulded structure also improves stray-light suppression, environmental sealing, and long-term reliability under humidity and temperature stress.
The technology also enables precision moulded-in optical features directly within the package, including integrated lenses, apertures, reflectors, filters, and beam-shaping optics. According to the company, these integral optics maintain highly repeatable alignment between the semiconductor die and the optical axis—an essential requirement in precision aerospace and defence systems such as optical encoders, fibre-optic gyroscopes (FOGs), beam alignment modules, target-tracking systems, and high-accuracy position sensors.
