+44 (0)24 7671 8970
More publications     •     Advertise with us     •     Contact us
 
News Article

Infinera 100G subsea network spans 38,000km

Using its indium phosphide PIC technology, the firm has deployed its DTN-X technology under water
Infinera 's InP based DTN-X platform with ultra-long haul 500G FlexCoheren super-channel technology is now being deployed in eight subsea networks across approximately 38,000 route kilometres of undersea fibre.

Infinera has publicly announced the DTN-X platform in submarine networks with customers including Telefonica, MedNautilus, PIPE Networks, PACNET and KDDI.

Infinera's solutions have reduced deployment times from months to days while also improving space utilisation by up to 33 percent. Submarine network operators have leveraged this new level of speed and efficiency along with the unique operational efficiency of 500G WDM super-channels enabling them to build subsea networks faster while driving down total cost of ownership. 

Also, Infinera subsea solutions, which are built upon InP photonic integrated circuit technology, are seamlessly integrated with terrestrial networks reducing costs by eliminating equipment and power requirements, while further improving overall network reliability and resiliency.

“There is a significant opportunity for 100G coherent solutions in the long haul subsea market," says Ron Kline, Principal Analyst Network Infrastructure, Ovum. “100G upgrades for subsea systems are definitely becoming more common, particularly as the financing climate for new cables remains weak and operators can increase capacity by a factor of ten in a short time period compared to constructing a new cable system.”

“Subsea network operators are very discerning customers because they operate mission-critical networks that typically exceed terrestrial specifications,” adds Steve Grubb, Infinera Fellow. "With demand for increased capacity on Submarine routes, the DTN-X, featuring FlexCoherent technology, is delivering submarine operators differentiation in the form of speed and reliability as well as lower total cost of ownership for 100G coherent optical subsea networks.  Further, with network resiliency enhancements like Infinera’s FastSMP, network protection not only improves reliability, but also lowers cost."

The company continues to add capabilities to Infinera's Submarine Solutions to support network operators. Earlier this year, Infinera conducted a trial with Telstra Global, successfully demonstrating Soft Decision Forward Error Correction (SD-FEC) across a 4,200 km submarine link between Hawaii and California.

Infinera will participate next week at the SubOptic 2013 Conference which takes place between April 22nd and 25th at the Marriot Rive Gauche in Paris, France. At the conference, Infinera engineers will discuss the latest optical networking technologies to support submarine networks and share how the innovation behind the Infinera DTN-X platform has enabled the firm to gain traction in submarine networks globally.

Infinera's engineers will give presentations addressing the latest developments in technologies that enable next-generation submarine networking solutions.

Steve Grubb will lead a tutorial with Antti Kankkunen, Vice President Product Planning at Infinera, Andy Lumsden, Chief Technology Officer at PACNET and Michael Enrico, Chief Technology Officer at DANTE titled "OTN and Mesh Network Protection" on April 23rd at 1:30pm

Emily Burmeister, Infinera Senior Engineer, will present a poster session titled "Diminished nonlinear impact of bit-aligned polarization multiplexing with advanced modulation formats on subsea cables" on April 24th at 4pm.

Xiaohui Yang, Infinera Senior Systems Engineer, will present a poster session titled "Demonstration of Effective Idler Solutions in Subsea Field Trials" on April 24th at 4pm.

Pierre Mertz, Infinera Senior Principal Engineer, will present "Unrepeatered Systems & Upgrade Technologies TCM-QPSK provides 2.0dB gain over BPSK in Festoon" on April 25th at 1:30pm.

 

×
Search the news archive

To close this popup you can press escape or click the close icon.
×
Logo
×
Register - Step 1

You may choose to subscribe to the Compound Semiconductor Magazine, the Compound Semiconductor Newsletter, or both. You may also request additional information if required, before submitting your application.


Please subscribe me to:

 

You chose the industry type of "Other"

Please enter the industry that you work in:
Please enter the industry that you work in: