EPC releases eGaN Phase 18 reliability report
Efficient Power Conversion (EPC) has released its Phase 18 Reliability Report, providing new insights into eGaN device reliability.
The report builds on previous work by closing the gap between lab-generated reliability testing and real-world device performance across mission profiles. It introduces new methodologies to better predict device lifetime under application-specific stress conditions, shaped through close collaboration with customers and supported by peer-reviewed research and international conference publications.
The report emphasises the significance of comprehending the fundamental wear-out mechanisms in GaN HEMTs and presents a quantitative methodology for estimating the overall device lifetime based on the predominant stress conditions experienced during operation. The methodology allows for more accurate lifetime predictions across a wide range of applications by combining different stress factors, like voltage, current, temperature, and duty cycles.
Phase 18 is similar to earlier reports, but acording to EPC it goes much deeper into the main wear-out mechanisms. These include the reliability of gates in pGaN structures, the ability to handle stress and overvoltage (robustness), the maximum current density, and the wear-out of thermomechanical devices in both chip-scale and QFN-packaged formats. The report also looks at reliability in dynamic switching conditions and high-frequency operation, which gives us a better idea of how things work in real life.
In addition, the report introduces mission-specific reliability evaluations, including motor drive applications characterised by rapid current transients and varying load conditions. A customised testing methodology is presented to emulate these application-specific stress profiles, demonstrating the robustness of EPC’s GaN technology under such conditions.
“Phase 18 represents a significant advancement in understanding how eGaN devices behave under real operating conditions,” said Shengke Zhang, EPC's VP of product reliability. “By identifying intrinsic wear-out mechanisms and linking them to mission-specific stress conditions, we can more accurately predict device lifetime and support more reliable system design.”
“The Phase 18 Reliability Report reflects not only EPC’s continued innovation in GaN technology, but also the strength of collaboration with our customers,” said Alex Lidow, CEO of EPC. “We sincerely thank all the customers who contributed through constructive discussions and even challenging requirements - this level of engagement is essential to closing the gap between lab testing and real-world performance.”
The Phase 18 Reliability Report will be showcased at APEC. The report is also on EPC’s website.
