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Tuesday 9th May 2023
Rohm begins mass producing 650V GaN HEMTs
Monday 8th May 2023
Smartphone shipments slump
Monday 8th May 2023
Infineon and Foxconn to collaborate on SiC for EVs
Thursday 4th May 2023
What hinders UVC LED adoption?
Thursday 4th May 2023
Mouser and Navitas sign distribution agreement
Thursday 4th May 2023
AXT announces lower revenues in Q1
Thursday 4th May 2023
CVD Equipment releases SiC PVT system
Wednesday 3rd May 2023
BAE Systems and Eaton collaborate on EV trucks
Wednesday 3rd May 2023
CGD scale-ups presence at PCIM 2023
Wednesday 3rd May 2023
Infineon signs deals with two Chinese SiC suppliers
Tuesday 2nd May 2023
Innoscience demos GaN applications at PCIM
Tuesday 2nd May 2023
Transphorm introduces pin-compatible SuperGaN FETs
Tuesday 2nd May 2023
Onsemi focuses on sustainable power at PCIM
Tuesday 2nd May 2023
EPC and ADI introduce reference design
Tuesday 2nd May 2023
Asian MBE order for RIber
Thursday 27th April 2023
Moving perovskite PV out of the lab
Thursday 27th April 2023
Pioneering N-polar HEMTs
Thursday 27th April 2023
Bosch to acquire US chipmaker TSI
Thursday 27th April 2023
Aixtron benefits from power electronics growth
Wednesday 26th April 2023
Could OLEDS map magnetic fields?
Wednesday 26th April 2023
Navitas signs distribution agreement with Mouser
Wednesday 26th April 2023
GaN Systems to show on board charger design at PCIM
Wednesday 26th April 2023
EPC to demo real world GaN apps at PCIM
Wednesday 26th April 2023
Zeekr and Onsemi sign SiC chip deal
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