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Teledyne e2v HiRel announces X-band gain blocks

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New gain blocks extend performance of space-qualified InGaP amplifier technology

Teledyne e2v HiRel, part of the Teledyne Defence Electronics Group, has announced the availability of the new 14 GHz family of RF gain blocks spearheaded by an 18.4 dB amplifier (TDGB014-003). The Gain Blocks are based on an InGaP technology suitable for use in aerospace and defence applications because of its ceramic packaging and space qualification.

These gain blocks also come in gain configurations of 13.6 and 16.5dB which allow the design engineer to exactly configure the signal gain without incurring unwanted parasitic effects.

With this new family of X-band gain blocks, Teledyne e2v HiRel customers now have a standard amplifier solution that covers L-band through X-band, according to the company. This standard amplifier enables a reduction in the number of new qualified components required for flight programs, and thereby simplifies the component procurement process.

The TDGB014-003 50-ohm gain block uses a mature and reliable heterojunction bipolar transistor (HBT), InGaP process and incorporates proprietary MMIC design techniques. The process has space-flight heritage and has shown to be radiation tolerant to 100 krad, making it a viable choice for satellites and other high-altitude applications.

“Teledyne e2v HiRel has developed a broad portfolio of analogue, digital, power and RF semiconductors targeted at aerospace and defence applications,” said Mont Taylor, VP of business development. “We’re pleased to be able to incorporate InGaP technology into our current A&D product offerings. Additionally, we are excited to provide a growing portfolio of standard RF building blocks such as amplifiers, LNAs, PAs, DSAs, limiters, mixers, pre-scalers, PLLs, switches, and more to help customers design RF signal chains that meet the high-reliability requirements of defence and space.”

Teledyne e2v’s Hi-Rel X-band Gain Blocks are said to offer excellent gain flatness and high P1dB. This family is available now and is packaged in a 2-lead, ultra-small, hermetic, gullwing package. Both the wafer process technology and the package have space flight heritage.

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