EPC introduces latest ePower Stage chip
35A GaN ePower stage IC boosts power density and simplifies design
EPC has introduced a 100 V, 35A integrated circuit designed for 48 V DC-DC conversion used in high-density computing applications and in 48 V BLDC motor drives for e-mobility, robotics, and drones.
The EPC23102 eGaN IC is capable of a maximum withstand voltage of 100 V, delivering up to 35 A load current, while capable of switching speeds greater than 1 MHz.
Key features of the EPC23102 include integrated input logic interface, level shifting, bootstrap charging and gate drive buffer circuits controlling 6.6 mOhm RDS(on) high side and low side FETs configured as a half-bridge power stage. The EPC23102 also features a thermally enhanced QFN package with a footprint of just 3.5 mm x 5 mm, offering a compact solution size for high power density applications.
When operated in a 48 V to 12 V buck converter, the EPC23102 delivers greater than 96 percent peak efficiency at 1 MHz switching frequency and around 8 – 17 A of continuous load current with a rated current of 35 A.
“The ePower family of products makes it easy for designers to take advantage of the significant performance improvements made possible with GaN technology,” said Alex Lidow, CEO and co-founder of EPC. “Integrated devices are easier to design, easier to layout, easier to assemble, save space on the PCB, and increase efficiency. Designers can use these devices to make lighter weight and more precise BLDC motor drives, higher efficiency 48 V input DC-DC converters, higher fidelity class-d audio systems, and other industrial and consumer applications.”
The EPC90147 development board is a 100 V maximum device voltage, 35 A maximum output current, half bridge featuring the EPC23102 ePower Stage IC. The purpose of this board is to simplify the evaluation process of the EPC23102. This 50.8 mm x 50.8 mm board is designed for optimal switching performance and contains all critical components for easy evaluation.