SUSS MicroTec Launches Wafer Bonder
SUSS MicroTec, a supplier of equipment and process solutions for the semiconductor and related markets, has launched the SB6/8 Gen2 Wafer Bonder.
The semi-automated SB6/8 Gen2 is SUSS MicroTec's permanent wafer bonding system that handles wafers up to 200 mm and supports various substrate types and sizes.
The tool allows for fully manual processing in research and development applications while at the same time providing the opportunity of an easy switch to volume production. It supports low force for adhesive bonding as well as high force for thermo compression or eutectic bonding and offers various chamber pressure conditions from vacuum to over pressure. Flexible tooling allows for adapting to different requirements in the semiconductor industry. Major applications are in MEMS and LED packaging and production as well as 3D stacking.
The second tool generation provides an advanced heater and force control system as well as improved cooling rates.
