Georgia Tech hub to use ClassOne technology
ClassOne Technology has announced that Georgia Institute of Technology (Georgia Tech) has selected a Solstice S8 single-wafer processing system for its advanced packaging R&D program.
The Solstice order is central to a broader relationship between ClassOne and Georgia Tech in which ClassOne will support the establishment of a 3D Heterogeneous Integration Hub at the university’s Institute for Matter and Systems.
Georgia Tech's 3D systems packaging research covers all aspects of advanced packaging and heterogeneous integration which includes materials, design, processes, thermal management, power delivery, and assembly and integration driven by applications that include high-performance computing, artificial intelligence, automotive, mm-wave communication, and photonic connectivity.
Georgia Tech will implement the eight-chamber Solstice’s range of plating and surface preparation capabilities in back-end-of-line processing of silicon and glass substrates for 3D heterogeneous integration.
Each chamber in the Solstice S8 system, slated for shipment to Georgia Tech in Q4 2024, will be dedicated to a different advanced packaging process. The configuration will comprise two CopperMax chambers for pillar/redistribution layer (RDL) and through-silicon via (TSV) chemistries, individual chambers for tin-silver, gold, and nickel-tungsten plating, an etch chamber, and a vacuum pre-wet chamber. This fully loaded configuration brings all requirements for advanced packaging development onto one platform.
Jud Ready, principal research engineer and associate director, Institute for Matter and Systems at Georgia Tech, said, “Working with ClassOne and the Solstice tool is an effort to enhance our fabrication capabilities. The demands in this field require constant innovation, and this collaboration and tool will give our team new ways to innovate and produce.”
“Georgia Tech is leading the way in technological innovation at the university level,” said ClassOne Technology CEO Byron Exarcos. “We are excited to enable the school’s faculty, staff and students to pursue exceptional packaging R&D leveraging our equipment and strategic guidance, and we anticipate highly valuable results to emerge from this long-term relationship.”
Exarcos further noted that this is the first of several microelectronics-focused collaborations between ClassOne and leading universities planned over the next five years.
